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Name: LCMXO2-2000HC-6TG144I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-2000HC-6TG144I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO2-2000HC-6TG144I

Part No.:: LCMXO2-2000HC-6TG144I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 144-LQFP

Datasheet:: LCMXO2-2000HC-6TG144I.pdf

Description:: IC FPGA 111 I/O 144TQFP

In Stock:: 2535

Quantity:: Add To Cart

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LCMXO2-2000HC-6TG144I Specifications

Package/Case:
144-LQFP
Packaging:
Tray
Series:
MachXO2
ProductStatus:
Active
NumberofLABs/CLBs:
264
NumberofLogicElements/Cells:
2112
TotalRAMBits:
75776
NumberofI/O:
111
NumberofGates:
-
Voltage-Supply:
2.375V ~ 3.465V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

LCMXO2-2000HC-6TG144I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2-2000HC-6TG144I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2-2000HC-6TG144I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO2-2000HC-6TG144I information

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LCMXO2-2000HC-6TG144I performance and reliability evaluation in extreme environments

LCMXO2-2000HC-6TG144I is a field-programmable gate array (FPGA) chip designed by Lattice Semiconductor Corporation, offering versatile programmable logic capabilities for a wide range of applications. With its compact form factor and low power consumption, it is suitable for deployment in various embedded systems and IoT devices.

Environmental Considerations:

Incorporating LCMXO2-2000HC-6TG144I into electronic designs requires careful consideration of environmental factors to ensure reliable operation in extreme conditions. The following aspects are crucial in the design process:

- Temperature: The FPGA chip must withstand a broad temperature range, from extreme cold to high heat. Thermal management techniques such as heat sinks or thermal vias should be employed to dissipate heat effectively and prevent overheating, especially in enclosed or rugged environments.

- Humidity: Moisture ingress can lead to corrosion and short circuits, compromising the functionality of electronic components. Encapsulation techniques using conformal coatings or potting materials can safeguard LCMXO2-2000HC-6TG144I against moisture damage and ensure long-term reliability, particularly in outdoor or industrial settings.

- Vibration and Shock: In applications subject to mechanical stress or vibration, such as automotive or aerospace systems, the FPGA chip must be resistant to physical impacts and vibrations. Secure mounting methods and shock-absorbing materials should be employed to mitigate the risk of mechanical failure and maintain system integrity.

- Electromagnetic Interference (EMI): To ensure electromagnetic compatibility (EMC) and prevent EMI-induced malfunctions, proper shielding and grounding techniques should be implemented in the design. Shielded enclosures, twisted pair cables, and ferrite beads can suppress electromagnetic emissions and maintain signal integrity, enhancing the performance of LCMXO2-2000HC-6TG144I in noisy environments.

- Radiation: In applications exposed to ionizing radiation, such as medical imaging or aerospace electronics, radiation-hardened FPGA variants may be required to withstand radiation-induced errors and maintain functionality in harsh radiation environments. Selecting radiation-tolerant components ensures the reliability and resilience of LCMXO2-2000HC-6TG144I in radiation-prone applications.

Performance Evaluation:

To assess the performance and reliability of LCMXO2-2000HC-6TG144I in real-world scenarios, rigorous testing and validation procedures are essential. This involves subjecting the FPGA chip to simulated environmental stressors, such as temperature cycling, humidity exposure, mechanical shock, and EMI susceptibility tests, to evaluate its resilience and functional integrity under adverse conditions.

Moreover, long-term reliability assessments, including accelerated aging tests and reliability modeling, provide insights into the expected lifespan and failure mechanisms of LCMXO2-2000HC-6TG144I in demanding operational environments. By conducting comprehensive reliability analyses, designers can optimize system performance, minimize failure risks, and ensure the robustness of LCMXO2-2000HC-6TG144I-based solutions across diverse application domains.

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The price and inventory of LCMXO2-2000HC-6TG144I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of LCMXO2-2000HC-6TG144I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO2-2000HC-6TG144I we delivered, we will accept the replacement or return of the LCMXO2-2000HC-6TG144I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO2-2000HC-6TG144I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations