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Name: LCMXO2-2000HC-4BG256I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-2000HC-4BG256I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO2-2000HC-4BG256I

Part No.:: LCMXO2-2000HC-4BG256I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LFBGA

Datasheet:: LCMXO2-2000HC-4BG256I.pdf

Description:: IC FPGA 206 I/O 256CABGA

In Stock:: 2433

Quantity:: Add To Cart

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LCMXO2-2000HC-4BG256I Specifications

Package/Case:
256-LFBGA
Packaging:
Tray
Series:
MachXO2
ProductStatus:
Active
NumberofLABs/CLBs:
264
NumberofLogicElements/Cells:
2112
TotalRAMBits:
75776
NumberofI/O:
206
NumberofGates:
-
Voltage-Supply:
2.375V ~ 3.465V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

LCMXO2-2000HC-4BG256I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2-2000HC-4BG256I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2-2000HC-4BG256I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO2-2000HC-4BG256I information

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LCMXO2-2000HC-4BG256I performance and reliability evaluation in extreme environments

LCMXO2-2000HC-4BG256I is a field-programmable gate array (FPGA) chip manufactured by Lattice Semiconductor, renowned for its versatility and reliability in diverse applications. This article delves into its performance and reliability assessment in extreme environmental conditions, examining how its design accommodates factors such as high temperature, low temperature, humidity, and more.

Environmental Considerations:

- Thermal Management: The LCMXO2-2000HC-4BG256I chip incorporates advanced thermal management features, allowing it to operate efficiently even in high-temperature environments. Thermal vias and heat sinks can be integrated into the PCB design to dissipate heat effectively, ensuring optimal performance.

- Low-Temperature Operation: Robust design considerations enable the LCMXO2-2000HC-4BG256I to function reliably in low-temperature settings. Components with wide temperature tolerances and proper insulation techniques ensure consistent operation, even in freezing conditions.

- Humidity Resistance: The FPGA chip undergoes stringent testing to ensure resilience against humidity and moisture ingress. Conformal coating and sealing techniques safeguard sensitive components, mitigating the risk of corrosion and electrical malfunctions.

- Shock and Vibration: The LCMXO2-2000HC-4BG256I chip features robust packaging and mounting options to withstand mechanical shocks and vibrations encountered in harsh environments. Secure mounting techniques and shock-absorbing materials enhance overall reliability.

- Radiation Hardening: In applications where radiation exposure is a concern, the LCMXO2-2000HC-4BG256I chip can be radiation-hardened through specialized processes, ensuring dependable operation in aerospace, defense, and nuclear applications.

Performance Analysis:

- Signal Integrity: The LCMXO2-2000HC-4BG256I chip maintains excellent signal integrity even in harsh environmental conditions, facilitating reliable data transmission and processing in critical applications.

- Power Efficiency: Despite extreme environmental challenges, the LCMXO2-2000HC-4BG256I chip exhibits efficient power utilization, optimizing energy consumption without compromising performance.

- Functional Stability: Rigorous testing validates the LCMXO2-2000HC-4BG256I chip's functional stability across a wide temperature and humidity range, ensuring consistent operation under varying environmental conditions.

- Reliability Metrics: Statistical analysis and reliability modeling demonstrate the LCMXO2-2000HC-4BG256I chip's reliability metrics, including mean time between failures (MTBF) and failure modes, offering insights into its long-term performance.

- Application-Specific Performance: Real-world deployment scenarios showcase the LCMXO2-2000HC-4BG256I chip's performance in mission-critical applications, such as aerospace, automotive, industrial automation, and telecommunications, where reliability is paramount.

Conclusion:

The LCMXO2-2000HC-4BG256I FPGA chip exemplifies resilience and reliability in extreme environmental conditions, thanks to meticulous design considerations and rigorous testing protocols. Its versatile performance and robustness make it a preferred choice for applications demanding uncompromising reliability and functionality, even in the harshest operating environments.

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6. What is the process for return or replacement of LCMXO2-2000HC-4BG256I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO2-2000HC-4BG256I we delivered, we will accept the replacement or return of the LCMXO2-2000HC-4BG256I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO2-2000HC-4BG256I.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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