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Name: LCMXO2-1200ZE-3SG32C
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-1200ZE-3SG32C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO2-1200ZE-3SG32C

Part No.:: LCMXO2-1200ZE-3SG32C

Manufacturer:: Lattice Semiconductor Corporation

Package:: 32-UFQFN Exposed Pad

Datasheet:: LCMXO2-1200ZE-3SG32C.pdf

Description:: IC FPGA 21 I/O 32QFNS

In Stock:: 3358

Quantity:: Add To Cart

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LCMXO2-1200ZE-3SG32C Specifications

Package/Case:
32-UFQFN Exposed Pad
Packaging:
Tray
Series:
MachXO2
ProductStatus:
Active
NumberofLABs/CLBs:
160
NumberofLogicElements/Cells:
1280
TotalRAMBits:
65536
NumberofI/O:
21
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

LCMXO2-1200ZE-3SG32C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2-1200ZE-3SG32C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2-1200ZE-3SG32C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO2-1200ZE-3SG32C information

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LCMXO2-1200ZE-3SG32C performance and reliability evaluation in extreme environments

LCMXO2-1200ZE-3SG32C is a versatile FPGA (Field Programmable Gate Array) device known for its robust performance and reliability in various industrial and extreme environment applications. In this article, we will explore its performance and reliability assessment under extreme environmental conditions, including high temperature, low temperature, humidity, and more.

Environmental Considerations in Design:

When designing systems with LCMXO2-1200ZE-3SG32C for extreme environments, several environmental factors need to be considered:

- High Temperature: The FPGA should be capable of operating reliably at elevated temperatures commonly encountered in industrial settings or outdoor applications. Proper thermal management techniques such as heat sinks or fans may be employed to ensure optimal performance.

- Low Temperature: Similarly, the FPGA must function reliably in low-temperature environments, such as in aerospace or polar exploration applications. Cold temperature testing and selection of components rated for low-temperature operation are essential.

- Humidity: Humidity levels can affect the performance and longevity of electronic components. Proper sealing and conformal coating of the LCMXO2-1200ZE-3SG32C device and surrounding circuitry can protect against moisture ingress and ensure stable operation.

- Vibration and Shock: In rugged environments or applications subject to vibration and shock, the FPGA and its supporting components must be securely mounted and ruggedized to withstand mechanical stresses.

- EMC/EMI Protection: Electromagnetic compatibility (EMC) and electromagnetic interference (EMI) protection measures are crucial to prevent signal interference and ensure reliable operation of the LCMXO2-1200ZE-3SG32C device in the presence of electromagnetic noise.

Performance Analysis:

In practical applications, LCMXO2-1200ZE-3SG32C has demonstrated exceptional performance and reliability even in extreme environmental conditions. For example:

- Industrial Automation: In industrial automation systems operating in harsh environments with fluctuating temperatures and high levels of electromagnetic interference, LCMXO2-1200ZE-3SG32C has proven to be a reliable solution for control and monitoring tasks.

- Aerospace and Defense: In aerospace and defense applications where temperature extremes, vibration, and shock are prevalent, LCMXO2-1200ZE-3SG32C has been utilized for its ruggedness and resistance to environmental stresses.

- Automotive Electronics: In automotive electronics, where temperature variations and mechanical stresses are common, LCMXO2-1200ZE-3SG32C has been employed for functions such as engine control, infotainment systems, and driver assistance features.

Conclusion:

LCMXO2-1200ZE-3SG32C exhibits excellent performance and reliability in extreme environmental conditions, making it suitable for a wide range of applications across industries. By considering environmental factors during the design phase and implementing appropriate mitigation measures, engineers can ensure the robustness and longevity of systems utilizing LCMXO2-1200ZE-3SG32C FPGA devices.

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6. What is the process for return or replacement of LCMXO2-1200ZE-3SG32C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO2-1200ZE-3SG32C we delivered, we will accept the replacement or return of the LCMXO2-1200ZE-3SG32C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO2-1200ZE-3SG32C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations