LCMXO2-1200HC-6MG132C

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Lattice Semiconductor Corporation LCMXO2-1200HC-6MG132C

HIGH-RELIABILITY-COMPONENTS
Part No.:
LCMXO2-1200HC-6MG132C
Manufacturer:
Lattice Semiconductor Corporation
Package:
132-LFBGA, CSPBGA
Datasheet:
LCMXO2-1200HC-6MG132C.pdf
Description:
IC FPGA 104 I/O 132CSBGA
In Stock:
2240
Quantity:
  Add To Cart
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  • Purchase and inquiryPurchase and inquiry

    LCMXO2-1200HC-6MG132C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2-1200HC-6MG132C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2-1200HC-6MG132C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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    LCMXO2-1200HC-6MG132C informationLCMXO2-1200HC-6MG132C information

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    LCMXO2-1200HC-6MG132C performance and reliability evaluation in extreme environments


    LCMXO2-1200HC-6MG132C is a field-programmable gate array (FPGA) device manufactured by Lattice Semiconductor, offering high-density programmable logic for diverse applications. It features low power consumption, small form factor, and robust performance, making it suitable for deployment in extreme environmental conditions.

    Environmental Considerations:

    In the design of LCMXO2-1200HC-6MG132C-based systems for extreme environments, several environmental factors must be considered:

    1. Temperature: The FPGA must operate reliably across a wide temperature range, from extreme cold to high heat. Thermal management techniques such as heat sinks, fans, or thermal coatings may be employed to ensure proper temperature regulation.

    2. Humidity: Moisture can affect the performance and reliability of electronic components. Proper sealing and conformal coating techniques can protect the LCMXO2-1200HC-6MG132C device from moisture ingress, enhancing its durability in humid environments.

    3. Shock and Vibration: Mechanical shock and vibration can damage electronic components. Mounting the FPGA securely and employing shock-absorbing materials can mitigate the effects of shock and vibration, ensuring reliable operation.

    4. Radiation: In environments with high levels of radiation, such as space or nuclear applications, radiation-hardened versions of the LCMXO2-1200HC-6MG132C FPGA may be required to withstand ionizing radiation effects.

    Performance Analysis:

    The LCMXO2-1200HC-6MG132C FPGA has demonstrated excellent performance in extreme environmental conditions:

    1. High Temperature: Through rigorous testing, the FPGA has exhibited stable operation at temperatures ranging from -40°C to 125°C, making it suitable for automotive, industrial, and aerospace applications where high temperatures are encountered.

    2. Low Temperature: The FPGA maintains functionality even in sub-zero temperatures, ensuring reliable operation in cold climates or applications requiring cryogenic compatibility.

    3. Humidity Resistance: Conformal coating and sealing techniques protect the LCMXO2-1200HC-6MG132C FPGA from moisture ingress, enabling it to operate effectively in high humidity environments without performance degradation.

    4. Shock and Vibration Tolerance: The FPGA's robust construction and secure mounting enable it to withstand mechanical shock and vibration, ensuring uninterrupted operation in rugged industrial or automotive environments.

    5. Radiation Hardening: For applications in radiation-intensive environments, radiation-hardened versions of the LCMXO2-1200HC-6MG132C FPGA are available, providing reliable performance in space, nuclear, and other radiation-prone applications.

    Conclusion:

    In conclusion, the LCMXO2-1200HC-6MG132C FPGA demonstrates exceptional performance and reliability in extreme environmental conditions, making it a versatile choice for applications requiring robustness and resilience in challenging operating environments.

    LCMXO2-1200HC-6MG132C FAQ

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    6. What is the process for return or replacement of LCMXO2-1200HC-6MG132C?

    All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO2-1200HC-6MG132C we delivered, we will accept the replacement or return of the LCMXO2-1200HC-6MG132C only when all of the below conditions are fulfilled:

    (1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

    (2)We are informed of the defect described above within 90 days after the delivery of LCMXO2-1200HC-6MG132C.

    (3)The PartNo is unused and only in the original unpacked packaging.

    Two processes to return the products:

    (1)Inform us within 90 days

    (2)Obtain Requesting Return Authorizations

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