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Name: LCMXO1200C-4FTN256C
Brand: Lattice Semiconductor Corporation
SKU: LCMXO1200C-4FTN256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO1200C-4FTN256C

Part No.:: LCMXO1200C-4FTN256C

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LBGA

Datasheet:: LCMXO1200C-4FTN256C.pdf

Description:: IC FPGA 211 I/O 256FTBGA

In Stock:: 3106

Quantity:: Add To Cart

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LCMXO1200C-4FTN256C Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
MachXO
ProductStatus:
Active
NumberofLABs/CLBs:
150
NumberofLogicElements/Cells:
1200
TotalRAMBits:
9421
NumberofI/O:
211
NumberofGates:
-
Voltage-Supply:
1.71V ~ 3.465V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

LCMXO1200C-4FTN256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO1200C-4FTN256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO1200C-4FTN256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO1200C-4FTN256C information

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LCMXO1200C-4FTN256C performance and reliability evaluation in extreme environments

LCMXO1200C-4FTN256C is an FPGA (Field-Programmable Gate Array) device manufactured by Lattice Semiconductor, offering ultimate flexibility and performance for various digital design applications. This article delves into the performance and reliability evaluation of LCMXO1200C-4FTN256C in extreme environmental conditions, addressing design considerations for factors such as high temperature, low temperature, humidity, and its practical application performance.

Environmental Considerations:

Incorporating LCMXO1200C-4FTN256C into design projects necessitates a meticulous evaluation of environmental factors to ensure optimal functionality and reliability. This involves:

- High-Temperature Resilience: The FPGA's thermal management features and substrate materials must withstand elevated temperatures without compromising performance. Thermal vias, heat sinks, and proper airflow mechanisms are integral to dissipate heat effectively.

- Low-Temperature Operation: LCMXO1200C-4FTN256C should maintain functionality even in sub-zero conditions. Low-temperature testing ensures the device's ability to operate reliably across a wide range of environmental extremes.

- Humidity Tolerance: Moisture can adversely affect electronic components. Conformal coating and sealed enclosures protect LCMXO1200C-4FTN256C from humidity-induced damage, ensuring consistent performance in humid environments.

Practical Performance Analysis:

- Signal Integrity: LCMXO1200C-4FTN256C offers robust signal integrity, crucial for maintaining data integrity and system reliability in high-speed communication interfaces.

- Power Efficiency: The FPGA's power consumption characteristics influence overall system power efficiency. Optimized power management techniques, such as dynamic power gating and voltage scaling, enhance energy efficiency in diverse applications.

- Functional Versatility: With its configurable logic blocks and rich I/O resources, LCMXO1200C-4FTN256C accommodates various design requirements, ranging from digital signal processing to complex control algorithms.

- Reliability Testing: Rigorous reliability testing, including accelerated life testing and environmental stress screening, validates LCMXO1200C-4FTN256C's performance under extreme conditions, ensuring long-term reliability in mission-critical applications.

Conclusion:

Incorporating LCMXO1200C-4FTN256C into design projects necessitates a comprehensive understanding of its performance and reliability in extreme environmental conditions. By addressing key design considerations and conducting thorough performance evaluations, engineers can leverage the ultimate flexibility and reliability of LCMXO1200C-4FTN256C to realize innovative and resilient electronic systems across diverse applications.

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6. What is the process for return or replacement of LCMXO1200C-4FTN256C?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO1200C-4FTN256C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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