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Name: LCMXO1200C-3MN132I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO1200C-3MN132I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO1200C-3MN132I

Part No.:: LCMXO1200C-3MN132I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 132-LFBGA, CSPBGA

Datasheet:: LCMXO1200C-3MN132I.pdf

Description:: IC FPGA 101 I/O 132CSBGA

In Stock:: 2885

Quantity:: Add To Cart

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LCMXO1200C-3MN132I Specifications

Package/Case:
132-LFBGA, CSPBGA
Packaging:
Tray
Series:
MachXO
ProductStatus:
Active
NumberofLABs/CLBs:
150
NumberofLogicElements/Cells:
1200
TotalRAMBits:
9421
NumberofI/O:
101
NumberofGates:
-
Voltage-Supply:
1.71V ~ 3.465V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

LCMXO1200C-3MN132I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO1200C-3MN132I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO1200C-3MN132I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO1200C-3MN132I information

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LCMXO1200C-3MN132I performance and reliability evaluation in extreme environments

LCMXO1200C-3MN132I is a low-power, small-footprint FPGA (Field-Programmable Gate Array) device manufactured by Lattice Semiconductor Corporation. This device is designed to offer high performance and flexibility in a variety of applications, including industrial automation, automotive, consumer electronics, and more.

Environmental Considerations:

In designing LCMXO1200C-3MN132I-based systems for extreme environments, several environmental factors need to be taken into account:

- High Temperature: The device must be able to operate reliably at elevated temperatures encountered in industrial or automotive applications. Proper thermal management techniques, such as heat sinks or fans, may be necessary to ensure stable performance.

- Low Temperature: For applications in cold climates or refrigerated environments, the device's performance at low temperatures needs to be evaluated. Specialized packaging or insulation may be required to maintain functionality in freezing conditions.

- Humidity: Moisture can adversely affect the performance and reliability of electronic components. Sealants, conformal coatings, or encapsulation techniques may be employed to protect LCMXO1200C-3MN132I from moisture ingress.

- Vibration and Shock: In rugged environments such as automotive or aerospace applications, the device must withstand mechanical stress from vibrations and shocks. Secure mounting and shock-absorbing materials can help mitigate these effects.

- Radiation: In space or nuclear applications, radiation can cause bit flips or latch-up in electronic devices. Radiation-hardened packaging or error-correction techniques may be necessary to ensure reliable operation in radiation-rich environments.

Performance Analysis:

Despite the challenges posed by extreme environments, LCMXO1200C-3MN132I demonstrates robust performance and reliability in practical applications. In industrial automation, for example, the device can be used for real-time control and monitoring of manufacturing processes, even in harsh operating conditions.

- Temperature Compensation: Advanced thermal management techniques ensure that LCMXO1200C-3MN132I maintains consistent performance across a wide temperature range, enabling reliable operation in both hot and cold environments.

- Environmental Testing: Extensive testing and qualification processes validate the device's performance under various environmental stressors, guaranteeing its suitability for demanding applications.

- Field-Proven Reliability: Numerous deployments of LCMXO1200C-3MN132I in mission-critical systems attest to its reliability and durability in real-world scenarios, providing confidence to designers and end-users alike.

Conclusion:

In conclusion, LCMXO1200C-3MN132I exemplifies Lattice Semiconductor's commitment to delivering high-performance FPGA solutions that excel even in the most challenging environments. Through careful design considerations and rigorous testing, this device offers unmatched reliability and versatility for a wide range of applications, from industrial automation to aerospace and beyond.

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6. What is the process for return or replacement of LCMXO1200C-3MN132I?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO1200C-3MN132I.

(3)The PartNo is unused and only in the original unpacked packaging.

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