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Name: LC5256MB-5FN256I
Brand: Lattice Semiconductor Corporation
SKU: LC5256MB-5FN256I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LC5256MB-5FN256I

Part No.:: LC5256MB-5FN256I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-BGA

Datasheet:: LC5256MB-5FN256I.pdf

Description:: IC CPLD 256MC 5NS 256FBGA

In Stock:: 2020

Quantity:: Add To Cart

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LC5256MB-5FN256I Specifications

Package/Case:
256-BGA
Packaging:
Tray
Series:
ispXPLD® 5000MB
ProductStatus:
Obsolete
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
5 ns
VoltageSupply-Internal:
2.3V ~ 2.7V
NumberofLogicElements/Blocks:
8
NumberofMacrocells:
256
NumberofGates:
-
NumberofI/O:
141
OperatingTemperature:
-40°C ~ 105°C (TJ)
MountingType:
Surface Mount

LC5256MB-5FN256I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LC5256MB-5FN256I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LC5256MB-5FN256I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LC5256MB-5FN256I information

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Common technical challenges and solutions when using LC5256MB-5FN256I

LC5256MB-5FN256I is a field-programmable gate array (FPGA) chip commonly used in digital circuit design for its flexibility and reconfigurability. However, it presents several technical challenges that need to be addressed for successful integration into electronic systems.

Noise Issues:

Noise can degrade the performance of LC5256MB-5FN256I circuits, affecting signal integrity and reliability. To mitigate noise issues, proper grounding techniques, such as star grounding or ground planes, should be employed. Additionally, signal shielding and isolation techniques can help minimize electromagnetic interference (EMI) and reduce noise coupling between adjacent components.

Power Consumption:

High power consumption is a common concern when using LC5256MB-5FN256I in electronic systems, especially in battery-powered applications or those with strict power constraints. To address this issue, power optimization techniques such as clock gating, voltage scaling, and low-power design methodologies should be implemented. Furthermore, utilizing power-saving modes available in the FPGA and optimizing the design for efficient resource utilization can help reduce overall power consumption.

Integration Complexity:

Integration of LC5256MB-5FN256I into electronic systems can be complex due to its extensive functionality and configurability. To manage integration complexity, modular design approaches, such as using hierarchical design structures and IP (intellectual property) reuse, can simplify system integration and reduce development time. Additionally, employing advanced design tools and methodologies, such as hardware description languages (HDLs) and simulation tools, can aid in verifying and debugging the design before implementation, minimizing integration challenges.

Clock Management:

Effective clock management is crucial for LC5256MB-5FN256I-based designs to ensure proper timing and synchronization of internal signals. Clock skew, jitter, and signal integrity issues can arise if not handled correctly. Utilizing clock distribution networks with low skew and jitter, implementing clock domain crossing techniques, and performing thorough timing analysis are essential for robust clock management in FPGA designs.

Temperature Sensitivity:

LC5256MB-5FN256I devices are sensitive to temperature variations, which can affect their performance and reliability. Thermal management techniques such as heat sinking, thermal vias, and proper airflow in the system enclosure can help dissipate heat and maintain optimal operating temperatures. Additionally, monitoring and controlling the temperature of the FPGA device through thermal sensors and feedback mechanisms can prevent overheating and ensure long-term reliability.

Conclusion:

By addressing these technical challenges through appropriate design methodologies and optimization techniques, LC5256MB-5FN256I can be successfully integrated into electronic systems, delivering optimal performance, reliability, and efficiency.

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6. What is the process for return or replacement of LC5256MB-5FN256I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LC5256MB-5FN256I we delivered, we will accept the replacement or return of the LC5256MB-5FN256I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

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