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Name: LC4512B-5TN176C
Brand: Lattice Semiconductor Corporation
SKU: LC4512B-5TN176C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LC4512B-5TN176C

Part No.:: LC4512B-5TN176C

Manufacturer:: Lattice Semiconductor Corporation

Package:: 176-LQFP

Datasheet:: LC4512B-5TN176C.pdf

Description:: IC CPLD 512MC 5NS 176TQFP

In Stock:: 2478

Quantity:: Add To Cart

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LC4512B-5TN176C Specifications

Package/Case:
176-LQFP
Packaging:
Tray
Series:
ispMACH® 4000B
ProductStatus:
Obsolete
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
5 ns
VoltageSupply-Internal:
2.3V ~ 2.7V
NumberofLogicElements/Blocks:
32
NumberofMacrocells:
512
NumberofGates:
-
NumberofI/O:
128
OperatingTemperature:
0°C ~ 90°C (TJ)
MountingType:
Surface Mount

LC4512B-5TN176C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LC4512B-5TN176C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LC4512B-5TN176C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LC4512B-5TN176C information

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Common technical challenges and solutions when using LC4512B-5TN176C

LC4512B-5TN176C is a FPGA chip commonly used in digital circuit design, offering versatile functionality and programmability. It is particularly suitable for applications requiring high-speed data processing and complex logic implementations.

Technical Challenges:

When utilizing LC4512B-5TN176C in circuit designs, several technical challenges may arise, including:

1. Noise Issues: High-speed digital circuits often introduce noise, affecting the performance and reliability of the design. Noise mitigation techniques such as proper grounding, signal isolation, and filtering capacitors should be employed to minimize noise interference.

2. Power Consumption: FPGA devices like LC4512B-5TN176C can consume significant power, especially when operating at high frequencies or with a large number of logic elements. Power management strategies, including clock gating, power-down modes, and voltage scaling, can help reduce overall power consumption.

3. Integration Complexity: Implementing complex logic functions and routing resources efficiently within the constraints of LC4512B-5TN176C can be challenging. Careful architectural planning, optimal placement, and routing techniques are essential to maximize FPGA resource utilization and performance.

4. Timing Constraints: Meeting timing requirements in FPGA designs, especially with high-frequency signals, can be demanding. Techniques such as pipelining, register balancing, and timing analysis tools can help ensure that critical paths meet timing specifications.

5. Heat Dissipation: Intense computational tasks can lead to heat generation within the LC4512B-5TN176C device, potentially affecting its reliability. Adequate heat sinking, thermal management strategies, and ambient temperature control are crucial to prevent overheating and ensure long-term device operation.

Solutions and Improvements:

To address these challenges, the following solutions and improvements can be implemented:

- Noise Mitigation: Employ proper grounding techniques, use differential signaling where applicable, and incorporate decoupling capacitors to suppress noise.

- Power Optimization: Utilize power-saving features of the FPGA, optimize clock domains, and implement dynamic voltage and frequency scaling to minimize power consumption.

- Design Optimization: Optimize logic placement and routing, employ advanced synthesis and optimization tools, and utilize hierarchical design methodologies to manage complexity efficiently.

- Timing Analysis: Perform thorough timing analysis, utilize constraint-driven synthesis, and explore design trade-offs to meet timing requirements effectively.

- Thermal Management: Implement effective heat dissipation mechanisms, such as heat sinks, fans, or thermal vias, and monitor temperature levels during operation to prevent overheating.

By addressing these challenges proactively and adopting appropriate design techniques, engineers can effectively harness the capabilities of LC4512B-5TN176C in their digital circuit designs while ensuring reliable performance and efficiency.

LC4512B-5TN176C FAQ

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3. Are the LC4512B-5TN176C price and inventory displayed accurate?

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6. What is the process for return or replacement of LC4512B-5TN176C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LC4512B-5TN176C we delivered, we will accept the replacement or return of the LC4512B-5TN176C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LC4512B-5TN176C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations