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Name: LC4256ZC-75TN176I
Brand: Lattice Semiconductor Corporation
SKU: LC4256ZC-75TN176I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LC4256ZC-75TN176I

Part No.:: LC4256ZC-75TN176I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 176-LQFP

Datasheet:: LC4256ZC-75TN176I.pdf

Description:: IC CPLD 256MC 7.5NS 176TQFP

In Stock:: 2759

Quantity:: Add To Cart

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LC4256ZC-75TN176I Specifications

Package/Case:
176-LQFP
Packaging:
Tray
Series:
ispMACH® 4000Z
ProductStatus:
Active
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
7.5 ns
VoltageSupply-Internal:
1.7V ~ 1.9V
NumberofLogicElements/Blocks:
16
NumberofMacrocells:
256
NumberofGates:
-
NumberofI/O:
128
OperatingTemperature:
-40°C ~ 105°C (TJ)
MountingType:
Surface Mount

LC4256ZC-75TN176I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LC4256ZC-75TN176I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LC4256ZC-75TN176I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LC4256ZC-75TN176I information

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Common technical challenges and solutions when using LC4256ZC-75TN176I

LC4256ZC-75TN176I is a popular FPGA (Field-Programmable Gate Array) chip known for its flexibility and versatility in digital circuit design. However, its usage comes with several common technical challenges that engineers often encounter, including noise issues, power consumption concerns, and integration complexity.

Noise Issues:

To mitigate noise problems when using LC4256ZC-75TN176I, engineers can employ various techniques such as:

- Proper PCB layout design to minimize signal interference and crosstalk.

- Utilization of differential signaling for critical high-speed data paths.

- Implementation of filtering and decoupling capacitors to suppress high-frequency noise.

- Adoption of shielded cables and connectors to reduce electromagnetic interference (EMI).

- Careful placement of power supply components to minimize ground bounce and voltage fluctuations.

Power Consumption:

To address power consumption issues with LC4256ZC-75TN176I, engineers can explore the following strategies:

- Optimizing the FPGA's configuration to utilize only necessary resources, thereby reducing dynamic power consumption.

- Employing power gating techniques to selectively disable unused FPGA regions or peripherals when not in use.

- Utilizing low-power design methodologies such as clock gating and voltage scaling to minimize static and dynamic power consumption.

- Implementing efficient power management schemes, including dynamic voltage and frequency scaling (DVFS), to match the FPGA's performance with the application's requirements dynamically.

- Exploring advanced power-saving modes provided by the FPGA vendor and leveraging standby or sleep modes during idle periods.

Integration Complexity:

To tackle integration complexities associated with LC4256ZC-75TN176I, engineers can adopt the following approaches:

- Utilizing standardized communication protocols and interfaces to simplify connectivity with external components or subsystems.

- Modularizing the design by breaking it down into smaller functional blocks, allowing for easier verification, testing, and debugging.

- Leveraging FPGA vendor-provided IP cores and libraries to expedite the development process and ensure compatibility with the target device.

- Employing simulation and emulation tools to validate the design before hardware implementation, reducing the risk of integration errors.

- Collaborating with experienced FPGA designers or seeking support from the FPGA vendor's application engineers to address specific integration challenges effectively.

Conclusion:

While utilizing LC4256ZC-75TN176I in digital circuit design offers immense flexibility and customization options, engineers must carefully address common technical challenges such as noise, power consumption, and integration complexity. By employing appropriate design techniques and leveraging available resources, engineers can ensure optimal performance and reliability in their FPGA-based applications.

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6. What is the process for return or replacement of LC4256ZC-75TN176I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LC4256ZC-75TN176I we delivered, we will accept the replacement or return of the LC4256ZC-75TN176I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LC4256ZC-75TN176I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations