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Name: LC4256V-3FTN256AC
Brand: Lattice Semiconductor Corporation
SKU: LC4256V-3FTN256AC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LC4256V-3FTN256AC

Part No.:: LC4256V-3FTN256AC

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LBGA

Datasheet:: LC4256V-3FTN256AC.pdf

Description:: IC CPLD 256MC 3NS 256FTBGA

In Stock:: 2063

Quantity:: Add To Cart

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LC4256V-3FTN256AC Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
ispMACH® 4000V
ProductStatus:
Active
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
3 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
16
NumberofMacrocells:
256
NumberofGates:
-
NumberofI/O:
128
OperatingTemperature:
0°C ~ 90°C (TJ)
MountingType:
Surface Mount

LC4256V-3FTN256AC this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LC4256V-3FTN256AC price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LC4256V-3FTN256AC to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LC4256V-3FTN256AC information

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Common technical challenges and solutions when using LC4256V-3FTN256AC

LC4256V-3FTN256AC is a field-programmable gate array (FPGA) commonly utilized in digital system designs for its flexibility and reconfigurability. However, it presents several technical challenges that designers must address for optimal performance and reliability.

Noise Issues:

To mitigate noise issues in LC4256V-3FTN256AC designs, designers should employ proper grounding techniques, utilize low-noise power supplies, and incorporate filtering components such as ferrite beads and capacitors to suppress high-frequency noise. Additionally, careful PCB layout design and signal routing techniques can minimize signal integrity issues caused by noise.

Power Consumption:

Reducing power consumption in LC4256V-3FTN256AC designs is crucial for applications with strict power constraints or battery-powered devices. Designers can optimize power usage by implementing clock gating techniques, utilizing low-power modes when feasible, and optimizing the utilization of FPGA resources to minimize dynamic power consumption. Furthermore, employing efficient power management ICs and voltage regulators can help improve overall energy efficiency.

Integration Complexity:

The complexity of integrating LC4256V-3FTN256AC into a larger system can pose challenges for designers. To address this, designers should carefully plan the FPGA architecture and partitioning of functions to optimize resource utilization and performance. Additionally, utilizing high-level synthesis tools and IP cores can simplify design tasks and reduce development time. Collaborating closely with semiconductor vendors and leveraging their support resources can also aid in overcoming integration challenges.

Thermal Management:

Managing thermal issues is essential to ensure the reliable operation of LC4256V-3FTN256AC in demanding environments. Designers should incorporate proper thermal management techniques such as heat sinks, fans, or thermal vias in the PCB layout to dissipate heat effectively. Thermal analysis and simulation tools can help predict and mitigate potential hotspots within the FPGA device. Additionally, operating the FPGA within its specified temperature range and monitoring junction temperatures during operation are critical for preventing overheating and maintaining long-term reliability.

Configuration and Programming:

Ensuring proper configuration and programming of LC4256V-3FTN256AC is essential for correct device functionality. Designers should carefully follow the device datasheet and programming guidelines provided by the FPGA vendor. Implementing robust configuration mechanisms, such as using non-volatile configuration memories and CRC checks, can help prevent configuration errors and ensure reliable device operation. Additionally, incorporating built-in self-test (BIST) features can facilitate post-configuration verification and enhance system reliability.

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6. What is the process for return or replacement of LC4256V-3FTN256AC?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LC4256V-3FTN256AC we delivered, we will accept the replacement or return of the LC4256V-3FTN256AC only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LC4256V-3FTN256AC.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations