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Name: LC4256C-75FTN256BC
Brand: Lattice Semiconductor Corporation
SKU: LC4256C-75FTN256BC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LC4256C-75FTN256BC

Part No.:: LC4256C-75FTN256BC

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LBGA

Datasheet:: LC4256C-75FTN256BC.pdf

Description:: IC CPLD 256MC 7.5NS 256FTBGA

In Stock:: 3436

Quantity:: Add To Cart

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LC4256C-75FTN256BC Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
ispMACH® 4000C
ProductStatus:
Obsolete
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
7.5 ns
VoltageSupply-Internal:
1.65V ~ 1.95V
NumberofLogicElements/Blocks:
16
NumberofMacrocells:
256
NumberofGates:
-
NumberofI/O:
160
OperatingTemperature:
0°C ~ 90°C (TJ)
MountingType:
Surface Mount

LC4256C-75FTN256BC this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LC4256C-75FTN256BC price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LC4256C-75FTN256BC to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LC4256C-75FTN256BC information

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Common technical challenges and solutions when using LC4256C-75FTN256BC

LC4256C-75FTN256BC is a Field-Programmable Gate Array (FPGA) chip commonly used in various electronic applications for its flexibility and reconfigurability. However, its utilization presents several technical challenges that need to be addressed for optimal performance.

Noise Issues:

To mitigate noise issues in LC4256C-75FTN256BC, proper grounding techniques should be employed, and critical signal paths must be shielded to minimize electromagnetic interference (EMI). Additionally, implementing filtering components such as capacitors and ferrite beads can help suppress noise in power and signal lines.

Power Consumption:

Reducing power consumption in LC4256C-75FTN256BC can be achieved through efficient utilization of resources and optimization of the FPGA design. Techniques such as clock gating, power gating, and dynamic voltage and frequency scaling (DVFS) should be employed to minimize power usage during both active and idle states.

Integration Complexity:

Managing the integration complexity of LC4256C-75FTN256BC involves careful planning of the FPGA architecture and partitioning of the design into manageable modules. Utilizing high-level synthesis (HLS) tools can simplify the development process by automatically generating hardware from abstract software descriptions, reducing manual coding efforts and potential errors.

Heat Dissipation:

Effective heat dissipation strategies are essential to prevent overheating in LC4256C-75FTN256BC. Utilize heat sinks, thermal vias, and proper airflow within the system enclosure to dissipate heat generated during FPGA operation. Thermal simulation tools can help identify hotspots and optimize heat dissipation mechanisms accordingly.

Signal Integrity:

Ensuring signal integrity is crucial for reliable operation of LC4256C-75FTN256BC-based systems. Implementing impedance matching techniques, controlling signal routing lengths, and adhering to high-speed design guidelines can minimize signal degradation and ensure robust communication between FPGA and other components.

Conclusion:

By addressing noise issues, optimizing power consumption, managing integration complexity, enhancing heat dissipation, and ensuring signal integrity, designers can overcome common technical challenges associated with LC4256C-75FTN256BC and maximize the performance and reliability of FPGA-based systems.

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

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