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Name: LC4256C-3FTN256AC
Brand: Lattice Semiconductor Corporation
SKU: LC4256C-3FTN256AC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LC4256C-3FTN256AC

Part No.:: LC4256C-3FTN256AC

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LBGA

Datasheet:: LC4256C-3FTN256AC.pdf

Description:: IC CPLD 256MC 3NS 256FTBGA

In Stock:: 2949

Quantity:: Add To Cart

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LC4256C-3FTN256AC Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
ispMACH® 4000C
ProductStatus:
Obsolete
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
3 ns
VoltageSupply-Internal:
1.65V ~ 1.95V
NumberofLogicElements/Blocks:
16
NumberofMacrocells:
256
NumberofGates:
-
NumberofI/O:
128
OperatingTemperature:
0°C ~ 90°C (TJ)
MountingType:
Surface Mount

LC4256C-3FTN256AC this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LC4256C-3FTN256AC price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LC4256C-3FTN256AC to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LC4256C-3FTN256AC information

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Common technical challenges and solutions when using LC4256C-3FTN256AC

LC4256C-3FTN256AC is a field-programmable gate array (FPGA) commonly utilized in digital circuit design for its versatility and reconfigurability. However, its integration into complex systems often poses several technical challenges that need to be addressed for optimal performance.

Noise Issues:

One common challenge when using LC4256C-3FTN256AC is dealing with noise, which can affect signal integrity and overall system performance. To mitigate this, proper grounding techniques and decoupling capacitors should be employed on power rails and critical signal lines. Additionally, careful PCB layout design, including proper trace routing and isolation of sensitive components, can help minimize noise susceptibility.

Power Consumption:

Another challenge is managing power consumption, especially in battery-powered or energy-sensitive applications. Utilizing power optimization features provided by the FPGA vendor, such as clock gating and power gating, can significantly reduce dynamic power consumption. Furthermore, optimizing the design's logic utilization and resource allocation can lead to more efficient FPGA configurations, lowering overall power requirements.

Integration Complexity:

Integrating LC4256C-3FTN256AC into a larger system can introduce complexity due to interfacing with other components and ensuring compatibility with existing infrastructure. Utilizing standardized communication protocols, such as SPI or I2C, for interfacing with peripherals can simplify integration efforts. Additionally, modularizing the design and utilizing abstraction layers can facilitate easier system integration and future scalability.

Temperature Management:

Temperature management is crucial for ensuring reliable operation of LC4256C-3FTN256AC, as excessive heat can degrade performance and potentially lead to device failure. Employing efficient thermal design techniques, such as heat sinks or thermal vias, can help dissipate heat effectively. Additionally, monitoring internal temperature sensors within the FPGA and implementing thermal throttling mechanisms can prevent overheating and ensure long-term reliability.

Configuration and Programming:

Programming and configuring LC4256C-3FTN256AC can be a daunting task, especially for complex designs. Utilizing automated synthesis and place-and-route tools provided by FPGA development suites can streamline the design process and minimize human errors. Moreover, adopting hardware description languages (HDLs) like Verilog or VHDL and employing design best practices can enhance code readability, maintainability, and scalability.

Conclusion:

In conclusion, while LC4256C-3FTN256AC offers tremendous flexibility and performance in digital circuit design, addressing challenges such as noise, power consumption, integration complexity, temperature management, and configuration optimization is essential for maximizing its potential in diverse applications.

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6. What is the process for return or replacement of LC4256C-3FTN256AC?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LC4256C-3FTN256AC we delivered, we will accept the replacement or return of the LC4256C-3FTN256AC only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LC4256C-3FTN256AC.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations