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Name: LAMXO640C-3FTN256E
Brand: Lattice Semiconductor Corporation
SKU: LAMXO640C-3FTN256E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LAMXO640C-3FTN256E

Part No.:: LAMXO640C-3FTN256E

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LBGA

Datasheet:: LAMXO640C-3FTN256E.pdf

Description:: IC CPLD 320MC 4.9NS 256TQFP

In Stock:: 2546

Quantity:: Add To Cart

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LAMXO640C-3FTN256E Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
LA-MachXO
ProductStatus:
Active
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
4.9 ns
VoltageSupply-Internal:
1.71V ~ 3.465V
NumberofLogicElements/Blocks:
-
NumberofMacrocells:
320
NumberofGates:
-
NumberofI/O:
159
OperatingTemperature:
-40°C ~ 125°C (TA)
MountingType:
Surface Mount

LAMXO640C-3FTN256E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LAMXO640C-3FTN256E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LAMXO640C-3FTN256E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LAMXO640C-3FTN256E information

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Common technical challenges and solutions when using LAMXO640C-3FTN256E

LAMXO640C-3FTN256E is a field-programmable gate array (FPGA) commonly utilized in various embedded systems and digital designs. It offers flexibility, customization, and high-performance computing capabilities, but it also presents several technical challenges that need to be addressed for successful implementation.

Noise Issues:

One common challenge when using LAMXO640C-3FTN256E is managing noise in the system. High-frequency switching operations within the FPGA can generate electromagnetic interference (EMI) and introduce noise into adjacent components. To mitigate this issue, designers can employ techniques such as proper decoupling capacitor placement, ground plane design, and signal integrity analysis to minimize noise propagation and ensure reliable operation.

Power Consumption:

Another significant concern is power consumption, especially in battery-powered or energy-efficient applications. LAMXO640C-3FTN256E devices can consume considerable power during operation, leading to thermal management challenges and reduced battery life. To address this, designers can optimize FPGA configurations, utilize power-saving modes, and implement dynamic voltage and frequency scaling (DVFS) techniques to reduce power consumption without sacrificing performance.

Integration Complexity:

Integrating LAMXO640C-3FTN256E into a system can be complex due to its customizable nature and the need to interface with various peripheral components. Designers must carefully manage pin assignments, protocol compatibility, and timing constraints to ensure seamless integration with other system elements. Utilizing comprehensive design tools, simulation software, and modular design methodologies can streamline the integration process and minimize development time.

Timing Constraints:

Timing closure is another critical aspect of FPGA design, especially in high-speed applications. Meeting timing constraints and ensuring proper signal synchronization across different FPGA modules can be challenging, requiring careful design optimization and timing analysis. Designers can employ techniques such as pipelining, clock domain crossing synchronization, and constraint-driven synthesis to address timing issues and achieve reliable operation at the desired clock frequencies.

Temperature Management:

Operating LAMXO640C-3FTN256E FPGAs at high frequencies can lead to increased operating temperatures, which may affect reliability and performance. Effective thermal management strategies, such as heatsink installation, airflow optimization, and temperature monitoring, are essential to prevent overheating and ensure long-term device reliability. Additionally, designers can implement thermal shutdown mechanisms and dynamic thermal management algorithms to prevent damage and maintain optimal operating conditions.

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

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(3)The PartNo is unused and only in the original unpacked packaging.

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