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Name: LAE3-17EA-6LFTN256E
Brand: Lattice Semiconductor Corporation
SKU: LAE3-17EA-6LFTN256E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LAE3-17EA-6LFTN256E

Part No.:: LAE3-17EA-6LFTN256E

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-BGA

Datasheet:: LAE3-17EA-6LFTN256E.pdf

Description:: IC FPGA 133 I/O 256FTBGA

In Stock:: 3637

Quantity:: Add To Cart

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LAE3-17EA-6LFTN256E Specifications

Package/Case:
256-BGA
Packaging:
Tray
Series:
LA-ECP3
ProductStatus:
Active
NumberofLABs/CLBs:
2125
NumberofLogicElements/Cells:
17000
TotalRAMBits:
716800
NumberofI/O:
133
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 125°C (TJ)

LAE3-17EA-6LFTN256E this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LAE3-17EA-6LFTN256E price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LAE3-17EA-6LFTN256E to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LAE3-17EA-6LFTN256E information

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LAE3-17EA-6LFTN256E application case analysis in emerging technology fields

LAE3-17EA-6LFTN256E is a high-performance FPGA (Field-Programmable Gate Array) chip manufactured by Lattice Semiconductor. It offers a combination of low power consumption, high-speed processing, and reconfigurability, making it suitable for a wide range of applications in fields such as telecommunications, industrial automation, and automotive electronics.

Application Scenario:

In a telecommunications network infrastructure, LAE3-17EA-6LFTN256E can be utilized for signal processing tasks, such as protocol conversion, encryption/decryption, and error correction. Its flexibility allows network operators to adapt to evolving communication standards and requirements.

Circuit Design:

To implement a signal processing module using LAE3-17EA-6LFTN256E, the following steps can be followed:

1. Functional Partitioning:

Identify the signal processing tasks to be performed and partition the functionalities into logical blocks. These blocks can include data input/output interfaces, processing cores, memory interfaces, and communication interfaces.

2. FPGA Configuration:

Program LAE3-17EA-6LFTN256E using a hardware description language (HDL) such as Verilog or VHDL to implement the desired logic functions. Utilize the FPGA's internal resources efficiently to maximize performance and minimize resource utilization.

3. Integration:

Integrate the FPGA module into the larger system design, connecting it to other components such as microcontrollers, sensors, actuators, and communication interfaces. Ensure proper signal interfacing and data synchronization between different modules.

4. Configuration Management:

Implement mechanisms for dynamic reconfiguration of the FPGA, allowing on-the-fly updates to the logic design to accommodate changes in system requirements or performance optimization. This flexibility enhances the adaptability and scalability of the system.

5. Power Optimization:

Utilize power management techniques such as clock gating, voltage scaling, and dynamic power management to minimize power consumption without compromising performance. Implementing power-saving strategies is crucial, especially in battery-operated or energy-constrained applications.

Considerations:

When designing with LAE3-17EA-6LFTN256E, it's essential to consider:

- Resource Utilization: Optimize the logic design to minimize resource usage and maximize the available capacity of the FPGA.

- Timing Constraints: Ensure that the timing requirements of the system are met by carefully designing and analyzing the propagation delays and clock frequencies of the FPGA design.

- Signal Integrity: Pay attention to signal integrity issues such as skew, crosstalk, and signal reflections to maintain reliable data transmission within the system.

- Security: Implement security features such as encryption, authentication, and secure boot mechanisms to protect the integrity and confidentiality of the FPGA configuration and data.

- Testability: Develop comprehensive testing procedures and tools to verify the functionality, performance, and reliability of the FPGA-based system under various operating conditions and corner cases.

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6. What is the process for return or replacement of LAE3-17EA-6LFTN256E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LAE3-17EA-6LFTN256E we delivered, we will accept the replacement or return of the LAE3-17EA-6LFTN256E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LAE3-17EA-6LFTN256E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations