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Name: ISPLSI 5256VE-100LF256I
Brand: Lattice Semiconductor Corporation
SKU: ISPLSI 5256VE-100LF256I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Lattice Semiconductor Corporation ISPLSI 5256VE-100LF256I

Part No.:: ISPLSI 5256VE-100LF256I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-BGA

Datasheet:: ISPLSI 5256VE-100LF256I.pdf

Description:: IC CPLD 256MC 10NS 256FBGA

In Stock:: 2200

Quantity:: Add To Cart

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ISPLSI 5256VE-100LF256I Specifications

Package/Case:
256-BGA
Packaging:
Tray
Series:
ispLSI® 5000VE
ProductStatus:
Obsolete
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
10 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
8
NumberofMacrocells:
256
NumberofGates:
12000
NumberofI/O:
144
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

ISPLSI 5256VE-100LF256I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including ISPLSI 5256VE-100LF256I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for ISPLSI 5256VE-100LF256I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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ISPLSI 5256VE-100LF256I information

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Common technical challenges and solutions when using ISPLSI 5256VE-100LF256I

ISPLSI 5256VE-100LF256I is a complex programmable logic device (CPLD) commonly used in digital circuit design for various applications. It offers high integration, flexibility, and reliability, but it also presents several technical challenges that need to be addressed for optimal performance.

1. Power Consumption:

Reducing power consumption is crucial, especially in battery-powered or energy-efficient applications. Techniques such as clock gating, power gating, and voltage scaling can be employed to minimize the power consumption of ISPLSI 5256VE-100LF256I during both active and standby modes.

2. Signal Integrity:

Signal integrity issues, including noise, crosstalk, and jitter, can affect the performance of the digital circuit. Proper PCB layout techniques, signal termination, and routing guidelines should be followed to mitigate these issues and ensure reliable operation of ISPLSI 5256VE-100LF256I-based designs.

3. Integration Complexity:

As ISPLSI 5256VE-100LF256I offers a high level of integration, managing the complexity of the design becomes a challenge. Utilizing hierarchical design methodologies, modularization, and abstraction layers can simplify the design process, improve maintainability, and facilitate scalability.

4. Design Verification:

Verifying the functionality and correctness of a complex digital design implemented on ISPLSI 5256VE-100LF256I requires thorough testing and simulation. Employing advanced verification techniques, such as formal verification, constrained random testing, and simulation-based testing, can help ensure that the design meets the desired specifications and requirements.

5. Timing Closure:

Achieving timing closure, i.e., ensuring that all timing constraints are met, is essential for the proper operation of ISPLSI 5256VE-100LF256I-based designs. Techniques such as pipelining, retiming, and adjusting timing constraints can be employed to address timing violations and optimize the performance of the digital circuit.

6. Design Security:

Protecting the intellectual property (IP) embedded in ISPLSI 5256VE-100LF256I-based designs from unauthorized access, reverse engineering, or tampering is critical. Implementing security features such as encryption, authentication, and access control mechanisms can safeguard the confidentiality and integrity of the design.

7. Thermal Management:

Managing the thermal dissipation of ISPLSI 5256VE-100LF256I is essential to prevent overheating and ensure long-term reliability. Proper heat sinking, thermal vias, and airflow design should be considered to dissipate heat effectively and maintain the operating temperature within safe limits.

8. Design for Manufacturability:

Designing ISPLSI 5256VE-100LF256I-based circuits with manufacturability in mind can streamline the fabrication and assembly process. Considering factors such as component placement, routing congestion, and testability can improve yield, reduce production costs, and accelerate time-to-market.

ISPLSI 5256VE-100LF256I FAQ

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6. What is the process for return or replacement of ISPLSI 5256VE-100LF256I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the ISPLSI 5256VE-100LF256I we delivered, we will accept the replacement or return of the ISPLSI 5256VE-100LF256I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of ISPLSI 5256VE-100LF256I.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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