HMC553ALC3B

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Analog Devices Inc. HMC553ALC3B

Part No.:
HMC553ALC3B
Manufacturer:
Analog Devices Inc.
Package:
12-CLCC Exposed Pad
Datasheet:
HMC553ALC3B.pdf
Description:
IC MMIC MIXER DBL-BAL 12SMD
In Stock:
283
Quantity:
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  • Purchase and inquiryPurchase and inquiry

    HMC553ALC3B this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including HMC553ALC3B price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for HMC553ALC3B to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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    HMC553ALC3B Typical application Circuitry

    HMC553ALC3B

    The HMC553ALC3B is a high-performance, double-balanced mixer chip designed for frequency conversion in RF and microwave applications. This chip is renowned for its excellent linearity, wide dynamic range, and high isolation.

    Applications: The HMC553ALC3B is widely used in communication systems, radar systems, electronic warfare, and test equipment where frequency mixing is crucial. It is particularly suited for applications requiring high linearity and wide bandwidth, such as in RF transceivers, up/down converters, and signal processing systems.

    Parameters: This mixer operates over a frequency range of 6 GHz to 26 GHz for the RF and LO ports and 0.1 GHz to 4 GHz for the IF port. It features a high input IP3 (Third-Order Intercept Point) for excellent linearity and high isolation between the ports to minimize crosstalk.

    Circuit Design for an RF Transceiver Application:

    1. Frequency Mixing: Utilize the HMC553ALC3B in the frequency conversion stage of the RF transceiver. Connect the RF input signal to pin 6 (RF), the local oscillator signal to pin 3 (LO), and the intermediate frequency output to pin 1 (IF).

    2. Port Isolation: Design proper isolation networks between the RF, LO, and IF ports to prevent leakage and crosstalk. This can be achieved using baluns or transformers to match the impedance and provide isolation.

    3. Power Supply: Provide a stable -5V supply to pin 2 (Vee) and ground pin 4 (GND) for proper operation. Use bypass capacitors close to the supply pin to filter out noise.

    4. LO Drive Level: Ensure that the local oscillator signal applied to pin 3 (LO) is within the specified drive level range to achieve optimal mixing performance without overdriving the mixer.

    5. Impedance Matching: Design proper impedance matching networks at the RF, LO, and IF ports (pins 6, 3, and 1, respectively) to ensure maximum power transfer and minimize reflections.

    6. Thermal Management: Ensure adequate heat sinking for the HMC553ALC3B to dissipate heat generated during operation and maintain stable performance.

    Design Considerations: When designing a circuit with the HMC553ALC3B, it is crucial to consider the isolation between ports for minimal crosstalk, the power supply stability to ensure consistent operation, and the LO drive level for optimal mixing performance. Additionally, impedance matching and thermal management should be carefully planned to prevent signal degradation and overheating.

    By integrating the HMC553ALC3B into your RF transceiver design, you can achieve high-performance frequency mixing with excellent linearity and wide bandwidth, enhancing the overall performance and flexibility of the system.

    HMC553ALC3B informationHMC553ALC3B information

    HMC553ALC3B FAQ

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    6. What is the process for return or replacement of HMC553ALC3B?

    All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the HMC553ALC3B we delivered, we will accept the replacement or return of the HMC553ALC3B only when all of the below conditions are fulfilled:

    (1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

    (2)We are informed of the defect described above within 90 days after the delivery of HMC553ALC3B.

    (3)The PartNo is unused and only in the original unpacked packaging.

    Two processes to return the products:

    (1)Inform us within 90 days

    (2)Obtain Requesting Return Authorizations

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