What is the Additional Feature ?

Name: HC20K400FC672AF
Brand: Intel
SKU: HC20K400FC672AF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel HC20K400FC672AF

Part No.:: HC20K400FC672AF

Manufacturer:: Intel

Package:: 672-BBGA

Datasheet:: HC20K400FC672AF.pdf

Description:: IC FPGA 672FBGA

In Stock:: 3324

Quantity:: Add To Cart

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HC20K400FC672AF Specifications

Package/Case:
672-BBGA
Packaging:
Tray
Series:
APEX® HardCopy®
ProductStatus:
Obsolete
NumberofLABs/CLBs:
-
NumberofLogicElements/Cells:
16640
TotalRAMBits:
212992
NumberofI/O:
-
NumberofGates:
400000
Voltage-Supply:
1.71V ~ 1.89V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

HC20K400FC672AF this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including HC20K400FC672AF price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for HC20K400FC672AF to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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HC20K400FC672AF information

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HC20K400FC672AF Application Introduction

HC20K400FC672AF is a high-density field-programmable gate array (FPGA) manufactured by Intel, featuring advanced programmable logic capabilities and high-speed performance.

Application Scenario:

In telecommunications infrastructure, HC20K400FC672AF can be utilized for signal processing tasks such as digital signal modulation/demodulation, error correction coding, and protocol handling in wireless base stations.

Circuit Design:

To effectively utilize HC20K400FC672AF in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to ensure optimal power utilization and minimize overall power consumption. Utilize low-power modes available in HC20K400FC672AF during idle or low activity periods.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal interference and maintain signal integrity. Properly terminate high-speed signal traces and use impedance-matched routing techniques to reduce signal reflections and ensure reliable data transmission.

3. Thermal Management:

Deploy effective thermal management solutions, such as heatsinks, thermal vias, and fans, to dissipate heat generated during operation and prevent overheating of HC20K400FC672AF. Ensure adequate airflow and ventilation within the system enclosure.

4. Clock Distribution:

Optimize clock distribution within the design to minimize clock skew and jitter. Use dedicated clock networks and low-skew clock distribution techniques to ensure synchronous operation of different modules within the FPGA.

5. Design Partitioning:

Partition the design into smaller, manageable modules to facilitate easier debugging, testing, and optimization. Utilize hierarchical design methodologies to improve design scalability and maintainability.

Considerations:

When designing with HC20K400FC672AF, it's essential to consider:

- Resource Utilization: Optimize FPGA resource utilization to maximize logic capacity and performance while minimizing area overhead.

- Timing Constraints: Meet timing constraints by carefully balancing clock frequencies, pipelining critical paths, and optimizing timing closure through synthesis and place-and-route optimizations.

- I/O Interface Design: Implement robust I/O interface circuits with proper voltage level shifting, signal conditioning, and ESD protection to ensure reliable communication with external devices.

- Design Verification: Thoroughly verify the design through simulation, emulation, and prototyping to ensure functional correctness, performance, and compliance with project requirements.

- Design Documentation: Maintain comprehensive design documentation, including design specifications, block diagrams, and test plans, to facilitate collaboration, troubleshooting, and future revisions.

HC20K400FC672AF FAQ

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3. Are the HC20K400FC672AF price and inventory displayed accurate?

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6. What is the process for return or replacement of HC20K400FC672AF?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the HC20K400FC672AF we delivered, we will accept the replacement or return of the HC20K400FC672AF only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of HC20K400FC672AF.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations