What is the Additional Feature ?

Name: HC1S40F780AF
Brand: Intel
SKU: HC1S40F780AF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel HC1S40F780AF

Part No.:: HC1S40F780AF

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: HC1S40F780AF.pdf

Description:: IC FPGA 613 I/O 780FBGA

In Stock:: 3292

Quantity:: Add To Cart

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HC1S40F780AF Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® HardCopy®
ProductStatus:
Obsolete
NumberofLABs/CLBs:
4125
NumberofLogicElements/Cells:
41250
TotalRAMBits:
2244096
NumberofI/O:
613
NumberofGates:
-
Voltage-Supply:
1.425V ~ 1.575V
MountingType:
Surface Mount
OperatingTemperature:
-

HC1S40F780AF this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including HC1S40F780AF price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for HC1S40F780AF to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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HC1S40F780AF information

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HC1S40F780AF Application Introduction

HC1S40F780AF is a high-performance field-programmable gate array (FPGA) chip manufactured by Intel, tailored for demanding applications in telecommunications, data centers, and automotive electronics.

Application Scenario:

In telecommunications infrastructure, HC1S40F780AF can be utilized to process high-speed data streams, implement complex algorithms for signal processing, and enable real-time data analysis in 5G networks.

Circuit Design:

To design a high-speed data processing system using HC1S40F780AF, follow these steps:

1. Power Management:

Ensure robust power supply design to meet the dynamic power requirements of HC1S40F780AF and associated peripherals. Implement voltage regulators with low output impedance and decoupling capacitors to minimize voltage fluctuations and ensure stable operation.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal distortions, reflections, and crosstalk. Use controlled impedance traces, proper termination techniques, and signal integrity simulation tools to optimize signal integrity and prevent timing errors in high-speed data transmission.

3. Thermal Management:

Implement effective thermal management solutions, such as heat sinks, thermal vias, and fans, to dissipate heat generated by HC1S40F780AF and prevent overheating. Ensure adequate airflow and thermal conduction paths to maintain the FPGA chip within the recommended operating temperature range.

4. Clock Distribution:

Design a robust clock distribution network to ensure stable and synchronized clock signals for HC1S40F780AF and peripheral components. Use low-skew clock distribution techniques, such as clock buffers and delay-locked loops (DLLs), to minimize clock skew and jitter.

5. I/O Interface:

Optimize the I/O interface design to support high-speed serial communication protocols, such as PCIe, Ethernet, and DDR, with external devices and memory modules. Use high-speed transceivers and impedance matching techniques to achieve reliable data transmission at gigabit speeds.

Considerations:

When designing with HC1S40F780AF, consider the following factors:

- Power Efficiency: Implement power-saving features, such as dynamic voltage and frequency scaling, to optimize power consumption and extend battery life in portable applications.

- Board-level Testing: Conduct thorough testing and validation of the PCB design to ensure compliance with timing constraints, signal integrity requirements, and thermal specifications.

- Security: Implement hardware security features, such as encryption engines and secure boot mechanisms, to protect sensitive data and prevent unauthorized access to the FPGA chip and system resources.

- Design Reusability: Modularize the design and use standardized interfaces to facilitate design reuse, scalability, and interoperability with other FPGA-based systems and IP cores.

- Lifecycle Management: Consider the long-term availability and support of HC1S40F780AF and plan for future migration paths to newer FPGA technologies to ensure continuity of product development and support.

HC1S40F780AF FAQ

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3. Are the HC1S40F780AF price and inventory displayed accurate?

The price and inventory of HC1S40F780AF fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of HC1S40F780AF?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the HC1S40F780AF we delivered, we will accept the replacement or return of the HC1S40F780AF only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of HC1S40F780AF.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations