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Name: EPM7512AET144C12GZ
Brand: Intel
SKU: EPM7512AET144C12GZ
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EPM7512AET144C12GZ

Part No.:: EPM7512AET144C12GZ

Manufacturer:: Intel

Package:: 144-LQFP

Datasheet:

Description:: IC CPLD 512MC 12NS 144TQFP

In Stock:: 2258

Quantity:: Add To Cart

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EPM7512AET144C12GZ Specifications

Package/Case:
144-LQFP
Packaging:
Tray
Series:
MAX® 7000A
ProductStatus:
Obsolete
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
12 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
32
NumberofMacrocells:
512
NumberofGates:
10000
NumberofI/O:
212
OperatingTemperature:
0°C ~ 70°C (TA)
MountingType:
Surface Mount

EPM7512AET144C12GZ this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EPM7512AET144C12GZ price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EPM7512AET144C12GZ to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EPM7512AET144C12GZ information

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Common technical challenges and solutions when using EPM7512AET144C12GZ

EPM7512AET144C12GZ is a Field-Programmable Gate Array (FPGA) renowned for its versatility and robust performance across a spectrum of applications, from telecommunications to aerospace. However, like any sophisticated electronic component, it presents certain technical challenges that demand adept handling for optimal functionality.

Noise Mitigation:

One prevalent challenge associated with EPM7512AET144C12GZ implementation is noise interference, stemming from various sources such as power supply fluctuations and signal crosstalk. To tackle this, employing proper decoupling capacitors strategically placed across the power rails aids in stabilizing voltage levels and reducing high-frequency noise. Additionally, employing differential signaling techniques and carefully routing critical signals can minimize electromagnetic interference (EMI), thus preserving signal integrity.

Power Management:

Efficient power management is pivotal in maximizing the performance and longevity of EPM7512AET144C12GZ-based systems. Advanced power supply designs incorporating low-dropout regulators (LDOs) and switch-mode power supplies (SMPS) ensure stable and clean power delivery to the FPGA and associated components. Moreover, leveraging power gating techniques and dynamic voltage and frequency scaling (DVFS) mechanisms tailored to the application's power requirements can significantly curb power consumption without compromising performance.

Integration Complexity:

The intricate nature of modern FPGA-based designs often poses integration complexities, necessitating meticulous planning and execution. Utilizing advanced synthesis and place-and-route algorithms streamlines design implementation, optimizing resource utilization and mitigating timing constraints. Additionally, adopting modular design methodologies, such as IP core reuse and hierarchical partitioning, simplifies system integration and facilitates design scalability, thereby reducing time-to-market and development costs.

Signal Integrity:

Preserving signal integrity is paramount in ensuring reliable operation of EPM7512AET144C12GZ in high-speed and mission-critical applications. Employing high-quality printed circuit board (PCB) materials with controlled impedance traces minimizes signal reflections and attenuates signal distortion. Furthermore, employing advanced signal conditioning techniques, such as pre-emphasis and equalization, compensates for signal degradation caused by transmission line effects, enabling robust communication interfaces and minimizing bit errors.

Thermal Management:

Effective thermal management is essential to prevent overheating and ensure long-term reliability of EPM7512AET144C12GZ-based systems, particularly in applications with stringent thermal constraints. Employing thermal simulation tools aids in identifying hotspots and optimizing heat dissipation solutions, such as heat sinks, thermal vias, and active cooling mechanisms. Additionally, incorporating temperature sensors and closed-loop thermal control algorithms enables real-time monitoring and regulation of FPGA temperature, safeguarding against thermal-induced performance degradation and potential reliability issues.

In conclusion, adeptly addressing the technical challenges associated with EPM7512AET144C12GZ necessitates a holistic approach encompassing noise mitigation, efficient power management, integration simplification, signal integrity preservation, and robust thermal management strategies. By employing advanced design methodologies and leveraging cutting-edge technologies, engineers can unleash the full potential of EPM7512AET144C12GZ and deliver robust and reliable FPGA-based solutions that meet the demands of today's dynamic and evolving applications.

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6. What is the process for return or replacement of EPM7512AET144C12GZ?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EPM7512AET144C12GZ we delivered, we will accept the replacement or return of the EPM7512AET144C12GZ only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EPM7512AET144C12GZ.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations