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Name: EPM7512AEF256C10GZ
Brand: Intel
SKU: EPM7512AEF256C10GZ
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EPM7512AEF256C10GZ

Part No.:: EPM7512AEF256C10GZ

Manufacturer:: Intel

Package:: 256-BGA

Datasheet:

Description:: IC CPLD 512MC 10NS 256FBGA

In Stock:: 2258

Quantity:: Add To Cart

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EPM7512AEF256C10GZ Specifications

Package/Case:
256-BGA
Packaging:
Tray
Series:
MAX® 7000A
ProductStatus:
Obsolete
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
10 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
32
NumberofMacrocells:
512
NumberofGates:
10000
NumberofI/O:
212
OperatingTemperature:
0°C ~ 70°C (TA)
MountingType:
Surface Mount

EPM7512AEF256C10GZ this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EPM7512AEF256C10GZ price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EPM7512AEF256C10GZ to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EPM7512AEF256C10GZ information

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Common technical challenges and solutions when using EPM7512AEF256C10GZ

EPM7512AEF256C10GZ is a high-density programmable logic device (PLD) commonly used in complex digital systems, such as telecommunications infrastructure, industrial automation, and aerospace applications.

Noise Issues:

To address noise issues in EPM7512AEF256C10GZ designs, proper grounding and shielding techniques should be employed. Additionally, using differential signaling for critical high-speed interfaces can help mitigate noise susceptibility. Implementing filtering components, such as ferrite beads or low-pass filters, in power supply lines can also suppress conducted and radiated noise.

Power Consumption:

Optimizing power consumption in EPM7512AEF256C10GZ designs involves careful attention to design architecture and utilization of power-saving features provided by the device. Utilize clock gating techniques to disable unused logic blocks and minimize dynamic power consumption. Employing low-power standby modes during idle periods can further reduce overall power consumption. Additionally, optimizing routing and placement to minimize signal switching activity can help decrease static power dissipation.

Integration Complexity:

Managing integration complexity with EPM7512AEF256C10GZ involves effective partitioning of the design into manageable modules and utilizing hierarchical design methodologies. Implementing proper timing constraints and floorplanning techniques can streamline design integration and optimize performance. Utilize design verification tools and methodologies, such as simulation and formal verification, to ensure correct functionality and timing closure. Leveraging intellectual property (IP) cores and pre-verified modules can also reduce integration effort and time-to-market.

Temperature Management:

To manage temperature in EPM7512AEF256C10GZ designs, employ thermal analysis during the design phase to identify hotspots and optimize heat dissipation. Utilize proper thermal management techniques, such as heat sinks, thermal vias, and fans, to ensure adequate cooling of the device and surrounding components. Implementing dynamic power management strategies, such as frequency scaling and voltage scaling, can help reduce power dissipation and subsequently lower temperature rise.

Signal Integrity:

Ensuring signal integrity in EPM7512AEF256C10GZ designs involves careful consideration of routing topologies, impedance matching, and signal termination techniques. Utilize controlled impedance routing for high-speed signals to minimize signal reflections and distortion. Implementing differential signaling and signal integrity analysis tools can help validate design robustness against noise and signal integrity issues. Employing proper PCB layout practices, such as minimizing trace lengths and avoiding routing over split power planes, can further enhance signal integrity.

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6. What is the process for return or replacement of EPM7512AEF256C10GZ?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EPM7512AEF256C10GZ we delivered, we will accept the replacement or return of the EPM7512AEF256C10GZ only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EPM7512AEF256C10GZ.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations