What is the Additional Feature ?

Name: EPM570GT100I5N
Brand: Intel
SKU: EPM570GT100I5N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EPM570GT100I5N

Part No.:: EPM570GT100I5N

Manufacturer:: Intel

Package:: 100-TQFP

Datasheet:: EPM570GT100I5N.pdf

Description:: IC CPLD 440MC 5.4NS 100TQFP

In Stock:: 2365

Quantity:: Add To Cart

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EPM570GT100I5N Specifications

Package/Case:
100-TQFP
Packaging:
Tray
Series:
MAX® II
ProductStatus:
Active
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
5.4 ns
VoltageSupply-Internal:
1.71V ~ 1.89V
NumberofLogicElements/Blocks:
570
NumberofMacrocells:
440
NumberofGates:
-
NumberofI/O:
76
OperatingTemperature:
-40°C ~ 100°C (TJ)
MountingType:
Surface Mount

EPM570GT100I5N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EPM570GT100I5N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EPM570GT100I5N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EPM570GT100I5N information

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Common technical challenges and solutions when using EPM570GT100I5N

EPM570GT100I5N is a field-programmable gate array (FPGA) widely used in various electronic applications due to its versatility and reconfigurability. However, its utilization presents several common technical challenges that need to be addressed for optimal performance and reliability.

Noise Issues:

One prevalent challenge when working with EPM570GT100I5N is noise interference, which can degrade signal integrity and affect overall system performance. To mitigate this issue, proper signal isolation techniques such as shielding sensitive traces, using differential signaling, and employing filtering components like ferrite beads or capacitors can be implemented. Additionally, optimizing the layout of the FPGA and surrounding components to minimize signal crosstalk and ground loops is crucial.

Power Consumption:

Another significant concern is power consumption, especially in portable or battery-powered applications. To address this challenge, designers can utilize power optimization features available in EPM570GT100I5N, such as clock gating, dynamic voltage and frequency scaling, and implementing low-power design techniques like asynchronous clock domains and power gating. Furthermore, careful analysis and profiling of the FPGA design to identify power-hungry modules and optimizing their implementation can significantly reduce overall power consumption.

Integration Complexity:

Managing the integration complexity associated with EPM570GT100I5N designs can be daunting, especially when dealing with large-scale systems or multi-FPGA architectures. To simplify integration, modularize the design by breaking it down into smaller, manageable blocks with well-defined interfaces. Utilizing standardized communication protocols like AXI or PCIe for inter-FPGA communication can streamline integration and improve scalability. Additionally, employing robust design methodologies such as hierarchical design, design reuse, and IP core integration can enhance overall productivity and maintainability.

Temperature Management:

Effective temperature management is crucial for ensuring reliable operation and longevity of EPM570GT100I5N-based systems, especially in environments with varying thermal conditions. Implementing thermal sensors to monitor FPGA temperature and dynamically adjusting operating parameters or activating cooling mechanisms like fans or heat sinks can prevent overheating and thermal-induced failures. Furthermore, optimizing FPGA placement and airflow within the system enclosure can help dissipate heat more efficiently and maintain optimal operating temperatures.

Signal Integrity:

Maintaining signal integrity is paramount for EPM570GT100I5N designs, particularly in high-speed and high-frequency applications where signal degradation can lead to data errors or system instability. Employing proper transmission line design practices, such as controlled impedance routing, minimizing signal reflections, and reducing skew through careful timing analysis and constraints, can ensure robust signal integrity. Additionally, performing thorough signal integrity simulations and validation tests during the design phase can identify and address potential signal integrity issues early in the development process.

EPM570GT100I5N FAQ

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6. What is the process for return or replacement of EPM570GT100I5N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EPM570GT100I5N we delivered, we will accept the replacement or return of the EPM570GT100I5N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EPM570GT100I5N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations