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Name: EPM570GF256C5N
Brand: Intel
SKU: EPM570GF256C5N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EPM570GF256C5N

Part No.:: EPM570GF256C5N

Manufacturer:: Intel

Package:: 256-BGA

Datasheet:: EPM570GF256C5N.pdf

Description:: IC CPLD 440MC 5.4NS 256FBGA

In Stock:: 3995

Quantity:: Add To Cart

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EPM570GF256C5N Specifications

Package/Case:
256-BGA
Packaging:
Tray
Series:
MAX® II
ProductStatus:
Active
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
5.4 ns
VoltageSupply-Internal:
1.71V ~ 1.89V
NumberofLogicElements/Blocks:
570
NumberofMacrocells:
440
NumberofGates:
-
NumberofI/O:
160
OperatingTemperature:
0°C ~ 85°C (TJ)
MountingType:
Surface Mount

EPM570GF256C5N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EPM570GF256C5N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EPM570GF256C5N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EPM570GF256C5N information

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Common technical challenges and solutions when using EPM570GF256C5N

EPM570GF256C5N is a FPGA (Field-Programmable Gate Array) device manufactured by Intel, offering high integration and flexibility for digital logic applications. However, like any complex integrated circuit, it presents several technical challenges that designers may encounter.

Noise Issues:

One common challenge with EPM570GF256C5N is noise susceptibility, especially in high-frequency applications or environments with electromagnetic interference (EMI). To mitigate this, designers can employ proper grounding techniques, shielding, and filtering components like capacitors and ferrite beads to suppress noise and maintain signal integrity.

Power Consumption:

Another significant concern is power consumption, particularly in battery-powered or energy-efficient systems. Designers can address this by optimizing the FPGA configuration and logic design to minimize dynamic power consumption. Additionally, implementing power gating techniques and utilizing low-power modes provided by EPM570GF256C5N can further reduce overall power consumption.

Complexity of Integration:

The complexity of integrating EPM570GF256C5N into a larger system can be daunting. To tackle this challenge, designers should adopt a modular and hierarchical design approach, breaking down the system into smaller, manageable blocks. Utilizing standardized interfaces and communication protocols facilitates seamless integration with other system components. Moreover, comprehensive simulation and verification methodologies help ensure the correct functionality and interoperability of the integrated system.

Temperature Management:

Effective temperature management is crucial for maintaining the reliability and performance of EPM570GF256C5N, especially in environments with varying thermal conditions. Designers can implement thermal monitoring circuits to track the device's temperature and employ thermal dissipation techniques such as heat sinks, fans, or thermal vias in the PCB layout to mitigate overheating risks.

Signal Integrity:

Ensuring robust signal integrity is paramount for EPM570GF256C5N applications, particularly in high-speed data transmission and communication systems. Designers should carefully consider the layout and routing of critical signals, minimize signal reflections and crosstalk, and adhere to signal integrity best practices such as controlled impedance routing and termination techniques.

Conclusion:

In conclusion, addressing challenges related to noise, power consumption, integration complexity, temperature management, and signal integrity is essential for maximizing the performance and reliability of EPM570GF256C5N-based designs. By implementing appropriate design techniques and methodologies, designers can overcome these hurdles and unlock the ultimate potential of this FPGA device in diverse application domains.

EPM570GF256C5N FAQ

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6. What is the process for return or replacement of EPM570GF256C5N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EPM570GF256C5N we delivered, we will accept the replacement or return of the EPM570GF256C5N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EPM570GF256C5N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations