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Name: EPM2210F324C5NRR
Brand: Intel
SKU: EPM2210F324C5NRR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EPM2210F324C5NRR

Part No.:: EPM2210F324C5NRR

Manufacturer:: Intel

Package:: 324-BGA

Datasheet:

Description:: IC CPLD 1700MC 7NS 324FBGA

In Stock:: 3889

Quantity:: Add To Cart

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EPM2210F324C5NRR Specifications

Package/Case:
324-BGA
Packaging:
Tray
Series:
MAX® II
ProductStatus:
Active
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
11.2 ns
VoltageSupply-Internal:
2.375V ~ 2.625V, 3V ~ 3.6V
NumberofLogicElements/Blocks:
2210
NumberofMacrocells:
1700
NumberofGates:
-
NumberofI/O:
272
OperatingTemperature:
0°C ~ 85°C (TJ)
MountingType:
Surface Mount

EPM2210F324C5NRR this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EPM2210F324C5NRR price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EPM2210F324C5NRR to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EPM2210F324C5NRR information

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Common technical challenges and solutions when using EPM2210F324C5NRR

EPM2210F324C5NRR is a Field-Programmable Gate Array (FPGA) chip commonly utilized in various digital design applications, presenting several technical challenges and considerations.

Noise Issues:

One common challenge when using EPM2210F324C5NRR is managing noise, which can affect the performance of the FPGA and the entire system. To mitigate noise problems, techniques such as proper grounding, signal isolation, and shielding can be employed. Additionally, implementing noise filtering mechanisms within the FPGA design, such as using low-pass filters or oversampling techniques, can help reduce noise interference.

Power Consumption:

Another significant concern is power consumption, as EPM2210F324C5NRR devices can consume considerable power, especially in complex designs or high-performance applications. To address this, power optimization techniques such as clock gating, power gating, and voltage scaling can be implemented at both the architectural and design levels. Additionally, utilizing power-saving features provided by the FPGA vendor and optimizing the logic synthesis and place-and-route processes can help reduce overall power consumption.

Integration Complexity:

The integration complexity of EPM2210F324C5NRR in a system can pose significant challenges, especially when interfacing with other components or when dealing with complex design requirements. Modular design practices, such as using hierarchical design structures and IP cores, can simplify integration efforts by encapsulating reusable functional blocks. Additionally, utilizing advanced simulation and verification tools can aid in verifying the functionality and compatibility of integrated components, reducing integration risks and time-to-market.

Clock Management:

Effective clock management is crucial for EPM2210F324C5NRR-based designs to ensure proper synchronization and timing closure. Techniques such as clock domain crossing analysis, clock tree synthesis optimization, and clock skew minimization are essential for maintaining signal integrity and meeting timing constraints. Additionally, employing FPGA-specific features such as clock conditioning circuits, PLLs (Phase-Locked Loops), and DCMs (Digital Clock Managers) can help achieve reliable clock distribution and synchronization.

Thermal Management:

Thermal issues can arise in EPM2210F324C5NRR-based systems, especially in high-performance applications where the FPGA operates at elevated temperatures. Proper thermal design considerations, such as heatsink placement, airflow management, and thermal simulation, are necessary to prevent overheating and ensure long-term reliability. Additionally, implementing dynamic power management techniques to adjust FPGA operating parameters based on temperature feedback can help mitigate thermal concerns and improve overall system stability.

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6. What is the process for return or replacement of EPM2210F324C5NRR?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EPM2210F324C5NRR we delivered, we will accept the replacement or return of the EPM2210F324C5NRR only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EPM2210F324C5NRR.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations