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Name: EPM1270T144C3RR
Brand: Intel
SKU: EPM1270T144C3RR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EPM1270T144C3RR

Part No.:: EPM1270T144C3RR

Manufacturer:: Intel

Package:: 144-LQFP

Datasheet:

Description:: IC CPLD 980MC 6.2NS 144TQFP

In Stock:: 3699

Quantity:: Add To Cart

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EPM1270T144C3RR Specifications

Package/Case:
144-LQFP
Packaging:
Tray
Series:
MAX® II
ProductStatus:
Active
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
6.2 ns
VoltageSupply-Internal:
2.375V ~ 2.625V, 3V ~ 3.6V
NumberofLogicElements/Blocks:
1270
NumberofMacrocells:
980
NumberofGates:
-
NumberofI/O:
116
OperatingTemperature:
0°C ~ 85°C (TJ)
MountingType:
Surface Mount

EPM1270T144C3RR this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EPM1270T144C3RR price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EPM1270T144C3RR to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EPM1270T144C3RR information

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Common technical challenges and solutions when using EPM1270T144C3RR

EPM1270T144C3RR is a field-programmable gate array (FPGA) known for its high integration density and versatile capabilities, commonly used in diverse electronic applications. It offers a wide range of configurable logic blocks and embedded memory resources, making it suitable for complex digital designs.

Technical Challenges:

When employing EPM1270T144C3RR in a design, several technical challenges may arise, including:

1. Noise Issues: Due to the high operating frequency and complex routing within the FPGA, noise coupling between adjacent signal lines or components can degrade signal integrity and affect system performance.

2. Power Consumption: The dynamic power consumption of EPM1270T144C3RR can be significant, especially when operating at high clock frequencies or with a large number of active logic elements, potentially leading to thermal management challenges and increased system cost.

3. Integration Complexity: Integrating various IP cores, peripherals, and custom logic within the EPM1270T144C3RR design can be complex, requiring careful planning, verification, and validation to ensure functional correctness and timing closure.

Solutions and Improvements:

To address these challenges and enhance the performance and reliability of designs utilizing EPM1270T144C3RR, consider the following solutions and improvements:

1. Noise Mitigation: Implement proper signal integrity techniques, such as impedance matching, termination resistors, and ground/power plane separation, to minimize noise coupling and ensure robust operation of critical signals.

2. Power Management: Employ dynamic power management techniques, such as clock gating, voltage scaling, and power gating, to optimize power consumption and reduce thermal stress on the device and surrounding components.

3. Design Partitioning: Break down the design into smaller, manageable modules with well-defined interfaces, allowing for easier integration, testing, and debugging. Utilize hierarchical design methodologies to streamline development and facilitate reuse of IP cores.

4. Timing Closure: Utilize advanced synthesis and place-and-route tools to optimize timing constraints and ensure proper timing closure. Perform thorough timing analysis and simulation to identify and address critical paths early in the design process.

5. Design Verification: Implement comprehensive verification strategies, including simulation, emulation, and hardware-in-the-loop testing, to validate the functionality and performance of the EPM1270T144C3RR design across various operating conditions and corner cases.

Conclusion:

By addressing noise, power, and integration challenges through effective design practices and utilizing advanced optimization techniques, designers can harness the full potential of EPM1270T144C3RR FPGA devices to deliver innovative and reliable electronic systems for a wide range of applications.

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6. What is the process for return or replacement of EPM1270T144C3RR?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EPM1270T144C3RR we delivered, we will accept the replacement or return of the EPM1270T144C3RR only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EPM1270T144C3RR.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations