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Name: EPM1270GF256C3N
Brand: Intel
SKU: EPM1270GF256C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EPM1270GF256C3N

Part No.:: EPM1270GF256C3N

Manufacturer:: Intel

Package:: 256-BGA

Datasheet:: EPM1270GF256C3N.pdf

Description:: IC CPLD 980MC 6.2NS 256FBGA

In Stock:: 3101

Quantity:: Add To Cart

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EPM1270GF256C3N Specifications

Package/Case:
256-BGA
Packaging:
Tray
Series:
MAX® II
ProductStatus:
Active
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
6.2 ns
VoltageSupply-Internal:
1.71V ~ 1.89V
NumberofLogicElements/Blocks:
1270
NumberofMacrocells:
980
NumberofGates:
-
NumberofI/O:
212
OperatingTemperature:
0°C ~ 85°C (TJ)
MountingType:
Surface Mount

EPM1270GF256C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EPM1270GF256C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EPM1270GF256C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EPM1270GF256C3N information

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Common technical challenges and solutions when using EPM1270GF256C3N

EPM1270GF256C3N is a field-programmable gate array (FPGA) device manufactured by Intel, offering high logic density and versatile programmability for a wide range of applications.

Technical Challenges:

When using EPM1270GF256C3N, several common technical challenges may arise, including:

1. Noise Issues: FPGA designs often encounter noise issues due to high-speed switching and signal integrity concerns, leading to timing violations and unreliable operation.

2. Power Consumption: High logic density and complex designs in EPM1270GF256C3N can lead to increased power consumption, necessitating efficient power management techniques to minimize energy usage and thermal issues.

3. Integration Complexity: Integrating various IP cores, interfaces, and peripherals into EPM1270GF256C3N designs can be challenging, requiring careful planning and optimization to meet performance and resource constraints.

Solutions and Improvements:

To address these challenges, the following solutions and improvements can be implemented:

1. Noise Mitigation: Employ proper PCB layout techniques, including impedance matching, signal routing, and power supply decoupling, to minimize noise and ensure signal integrity in EPM1270GF256C3N designs. Additionally, use clock domain crossing techniques and timing constraints to mitigate timing violations.

2. Power Optimization: Utilize power-aware synthesis and optimization tools to minimize logic duplication, optimize clock gating, and reduce unnecessary switching activities in EPM1270GF256C3N designs. Implement dynamic voltage and frequency scaling (DVFS) techniques to adjust voltage and frequency dynamically based on workload requirements.

3. IP Core Integration: Select and customize IP cores carefully to match the requirements of EPM1270GF256C3N designs, reducing resource utilization and improving performance. Utilize hierarchical design methodologies and IP reuse strategies to simplify integration and verification processes.

4. Design Verification: Perform thorough functional verification, including simulation, formal verification, and hardware emulation, to validate EPM1270GF256C3N designs and identify potential issues early in the development cycle. Use advanced debugging tools and techniques to diagnose and resolve integration and functionality issues efficiently.

5. Performance Optimization: Optimize critical paths, reduce logic duplication, and utilize advanced synthesis and optimization techniques to improve the performance of EPM1270GF256C3N designs. Implement parallelism, pipelining, and resource sharing to maximize resource utilization and achieve higher throughput.

Conclusion:

By addressing noise, power, and integration challenges through appropriate design techniques and methodologies, EPM1270GF256C3N can be effectively utilized to develop high-performance and reliable FPGA-based solutions for various applications.

EPM1270GF256C3N FAQ

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3. Are the EPM1270GF256C3N price and inventory displayed accurate?

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6. What is the process for return or replacement of EPM1270GF256C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EPM1270GF256C3N we delivered, we will accept the replacement or return of the EPM1270GF256C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EPM1270GF256C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations