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Name: EPM1270F256C5NAB
Brand: Intel
SKU: EPM1270F256C5NAB
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EPM1270F256C5NAB

Part No.:: EPM1270F256C5NAB

Manufacturer:: Intel

Package:: 256-BGA

Datasheet:

Description:: IC CPLD 980MC 6.2NS 256FBGA

In Stock:: 3686

Quantity:: Add To Cart

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EPM1270F256C5NAB Specifications

Package/Case:
256-BGA
Packaging:
Tray
Series:
MAX® II
ProductStatus:
Active
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
10 ns
VoltageSupply-Internal:
2.375V ~ 2.625V, 3V ~ 3.6V
NumberofLogicElements/Blocks:
1270
NumberofMacrocells:
980
NumberofGates:
-
NumberofI/O:
212
OperatingTemperature:
0°C ~ 85°C (TJ)
MountingType:
Surface Mount

EPM1270F256C5NAB this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EPM1270F256C5NAB price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EPM1270F256C5NAB to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EPM1270F256C5NAB information

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Common technical challenges and solutions when using EPM1270F256C5NAB

EPM1270F256C5NAB is a field-programmable gate array (FPGA) known for its high integration, flexibility, and performance, commonly used in various electronic applications. However, it presents several technical challenges that engineers encounter during design and implementation.

Noise Issues:

One common challenge with EPM1270F256C5NAB is managing noise in the system. This includes both internally generated noise from switching activities within the FPGA and external noise coupled into the device. To mitigate internal noise, proper power supply decoupling techniques should be employed, such as placing decoupling capacitors close to the power pins. Shielding techniques and careful routing practices can help reduce the impact of external noise on the FPGA.

Power Consumption:

Another significant challenge is managing power consumption, especially in applications where energy efficiency is crucial. Techniques such as clock gating, power gating, and dynamic voltage and frequency scaling (DVFS) can be employed to reduce power consumption during idle or low activity periods. Additionally, optimizing the FPGA design to minimize unnecessary logic utilization can contribute to lower power consumption.

Complexity of Integration:

Integrating EPM1270F256C5NAB into a system can be complex due to its high level of integration and the need to interface with various other components and subsystems. Proper system-level design, including clear communication protocols, standardized interfaces, and modular design practices, can help simplify integration efforts. Utilizing intellectual property (IP) cores and pre-designed modules can also expedite the integration process and reduce development time.

Timing Closure:

Timing closure is a critical challenge in FPGA design, including with EPM1270F256C5NAB, where meeting timing requirements can be difficult, especially in designs with high clock frequencies or complex logic paths. To address this challenge, designers can employ techniques such as pipelining, register retiming, and careful placement and routing to optimize timing paths and meet timing constraints. Additionally, utilizing advanced synthesis and place-and-route tools with timing-driven optimization capabilities can aid in achieving timing closure.

Resource Utilization:

Optimizing resource utilization in EPM1270F256C5NAB designs is crucial for maximizing performance and minimizing cost. Techniques such as logic synthesis optimizations, resource sharing, and hierarchical design methodologies can help efficiently utilize FPGA resources while meeting design requirements. Furthermore, utilizing vendor-specific optimization tools and guidelines can aid in optimizing resource utilization for specific FPGA architectures.

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6. What is the process for return or replacement of EPM1270F256C5NAB?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EPM1270F256C5NAB we delivered, we will accept the replacement or return of the EPM1270F256C5NAB only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EPM1270F256C5NAB.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations