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Name: EPM1270F256C3
Brand: Intel
SKU: EPM1270F256C3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EPM1270F256C3

Part No.:: EPM1270F256C3

Manufacturer:: Intel

Package:: 256-BGA

Datasheet:: EPM1270F256C3.pdf

Description:: IC CPLD 980MC 6.2NS 256FBGA

In Stock:: 2551

Quantity:: Add To Cart

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EPM1270F256C3 Specifications

Package/Case:
256-BGA
Packaging:
Tray
Series:
MAX® II
ProductStatus:
Active
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
6.2 ns
VoltageSupply-Internal:
2.5V, 3.3V
NumberofLogicElements/Blocks:
1270
NumberofMacrocells:
980
NumberofGates:
-
NumberofI/O:
212
OperatingTemperature:
0°C ~ 85°C (TJ)
MountingType:
Surface Mount

EPM1270F256C3 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EPM1270F256C3 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EPM1270F256C3 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EPM1270F256C3 information

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Common technical challenges and solutions when using EPM1270F256C3

EPM1270F256C3 is a field-programmable gate array (FPGA) device commonly used in various electronic systems, presenting several technical challenges that designers need to address effectively.

Noise Issues:

To mitigate noise problems in EPM1270F256C3 designs, designers can employ techniques such as proper power supply filtering, signal isolation, and grounding practices. Additionally, using differential signaling and impedance matching can help minimize noise susceptibility in high-speed interfaces.

Power Consumption:

Reducing power consumption in EPM1270F256C3 applications involves optimizing the design for power-efficient operation. This includes utilizing power gating techniques, clock gating, and low-power design methodologies. Furthermore, implementing dynamic voltage and frequency scaling (DVFS) can help adjust the power supply voltage and clock frequency based on the workload, further reducing overall power consumption.

Integration Complexity:

Managing the complexity of integrating various components and functionalities within EPM1270F256C3 designs requires careful planning and design partitioning. Using modular design practices, such as IP core reuse and hierarchical design methodologies, can simplify integration tasks and improve design scalability. Additionally, leveraging design automation tools and verification methodologies can streamline the development process and ensure design correctness.

Temperature Management:

Effective thermal management is crucial for maintaining EPM1270F256C3 reliability and performance. Designers can employ thermal simulation tools to analyze heat dissipation within the FPGA device and optimize the placement of heat sinks or thermal vias for efficient heat dissipation. Moreover, implementing temperature sensors and thermal monitoring circuits can enable dynamic thermal management strategies, such as thermal throttling or fan control, to prevent overheating and ensure long-term reliability.

Signal Integrity:

Ensuring signal integrity in EPM1270F256C3 designs involves minimizing signal distortion and noise interference along transmission paths. Designers can utilize techniques such as controlled impedance routing, signal termination, and signal integrity analysis tools to optimize signal integrity and maintain reliable communication between FPGA components and external devices. Additionally, implementing proper clock distribution networks and clock skew management techniques can further enhance signal integrity and system performance.

EPM1270F256C3 FAQ

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6. What is the process for return or replacement of EPM1270F256C3?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EPM1270F256C3 we delivered, we will accept the replacement or return of the EPM1270F256C3 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EPM1270F256C3.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations