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Name: EPF6024AFI256-2
Brand: Altera
SKU: EPF6024AFI256-2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Altera EPF6024AFI256-2

Part No.:: EPF6024AFI256-2

Manufacturer:: Altera

Package:: 256-BGA

Datasheet:: EPF6024AFI256-2.pdf

Description:: IC FPGA 219 I/O 256FBGA

In Stock:: 3984

Quantity:: Add To Cart

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EPF6024AFI256-2 Specifications

Package/Case:
256-BGA
Packaging:
Bulk
Series:
FLEX 6000
ProductStatus:
Active
NumberofLABs/CLBs:
196
NumberofLogicElements/Cells:
1960
TotalRAMBits:
-
NumberofI/O:
219
NumberofGates:
24000
Voltage-Supply:
3V ~ 3.6V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

EPF6024AFI256-2 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EPF6024AFI256-2 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EPF6024AFI256-2 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EPF6024AFI256-2 information

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EPF6024AFI256-2 performance and reliability evaluation in extreme environments

EPF6024AFI256-2 is a field-programmable gate array (FPGA) chip designed by Intel, offering high performance and flexibility for a wide range of applications, from telecommunications to aerospace.

Environmental Considerations:

In the design of EPF6024AFI256-2, several environmental factors are carefully considered to ensure reliable operation under extreme conditions:

- Temperature: The FPGA is designed to operate within specified temperature ranges, typically from -40°C to 85°C. Robust thermal management techniques are implemented to mitigate thermal stress and ensure performance stability across temperature variations.

- Humidity: Moisture-resistant packaging and conformal coating are applied to protect the FPGA from humidity-induced corrosion and electrical shorts, especially in high-humidity environments.

- Vibration and Shock: Mechanical reinforcements and shock-absorbing materials are integrated into the FPGA packaging to withstand vibrations and shocks encountered in rugged environments, such as automotive or military applications.

- Radiation: Radiation-hardened designs are employed for applications in space or nuclear environments, incorporating radiation-tolerant materials and error-correction techniques to mitigate the effects of ionizing radiation.

- Altitude: Specialized packaging and design considerations are made for applications at high altitudes, ensuring reliable operation under reduced air pressure and temperature extremes.

Performance Analysis:

In real-world applications, EPF6024AFI256-2 demonstrates exceptional performance and reliability:

- Telecommunications: The FPGA excels in telecommunications infrastructure, offering high-speed data processing and signal routing capabilities for network switches and routers, even in harsh environmental conditions.

- Aerospace: In aerospace applications, EPF6024AFI256-2 provides reliable performance for mission-critical functions such as avionics control, navigation systems, and satellite communication, withstanding extreme temperatures, radiation, and vibration.

- Industrial Automation: The FPGA is widely used in industrial automation systems for real-time control and monitoring of manufacturing processes, offering fast response times and deterministic operation, even in challenging industrial environments.

- Automotive: Automotive manufacturers leverage EPF6024AFI256-2 for advanced driver assistance systems (ADAS), engine control units (ECUs), and infotainment systems, benefiting from its reliability under temperature variations, vibrations, and humidity.

- Medical Devices: In medical applications, the FPGA ensures high-performance data processing and sensor interfacing for diagnostic equipment, patient monitoring devices, and medical imaging systems, meeting stringent reliability and safety standards.

Conclusion:

EPF6024AFI256-2 stands out as a versatile and reliable FPGA solution, engineered to thrive in extreme environmental conditions while delivering high performance across diverse applications, from telecommunications infrastructure to aerospace systems and beyond.

EPF6024AFI256-2 FAQ

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3. Are the EPF6024AFI256-2 price and inventory displayed accurate?

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6. What is the process for return or replacement of EPF6024AFI256-2?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EPF6024AFI256-2 we delivered, we will accept the replacement or return of the EPF6024AFI256-2 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EPF6024AFI256-2.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations