What is the Additional Feature ?

Name: EPF6016ATC144-3N
Brand: Intel
SKU: EPF6016ATC144-3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EPF6016ATC144-3N

Part No.:: EPF6016ATC144-3N

Manufacturer:: Intel

Package:: 144-LQFP

Datasheet:: EPF6016ATC144-3N.pdf

Description:: IC FPGA 117 I/O 144TQFP

In Stock:: 2242

Quantity:: Add To Cart

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EPF6016ATC144-3N Specifications

Package/Case:
144-LQFP
Packaging:
Tray
Series:
FLEX 6000
ProductStatus:
Obsolete
NumberofLABs/CLBs:
132
NumberofLogicElements/Cells:
1320
TotalRAMBits:
-
NumberofI/O:
117
NumberofGates:
16000
Voltage-Supply:
3V ~ 3.6V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

EPF6016ATC144-3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EPF6016ATC144-3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EPF6016ATC144-3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EPF6016ATC144-3N information

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EPF6016ATC144-3N Typical application Circuitry

The EPF6016ATC144-3N, a flagship model within the Flex 10k series from Altera (now part of Intel), exemplifies a confluence of flexibility and efficiency, tailored for a wide array of applications in digital logic and system design. This series is celebrated for its innovative use of programmable logic device (PLD) technology, incorporating an embedded array for implementing complex logic functions. The EPF6016ATC144-3N, with its ample logic elements and reconfigurable logic blocks, is recognized as a pivotal system-on-chip (SoC) solution, adept at catalyzing sophisticated digital designs.

1. Electrical Power Requirements and Arrangement: The EPF6016ATC144-3N operates on a versatile power supply configuration, designed to bolster its performance across diverse operational modes. This SoC mandates a primary power supply of 3.3V (VCCINT) for its internal logic operations, ensuring optimal efficiency of the processing core and internal logic. Furthermore, the configuration and I/O operations necessitate a 3.3V supply (VCCIO), supporting a broad spectrum of external connections. Precision in the delivery of these voltages is paramount, highlighting the criticality of refined power management and regulation to ensure the SoC's steadfast performance.

2. Optimization and Configuration for Peak Performance: Implementing the EPF6016ATC144-3N involves an intricate series of adjustments tailored to the application's specific demands. This process encompasses setting up the clock management for the processor and peripherals, initializing memory interfaces, and activating the inbuilt features via both hardware and software means. Each pin on the EPF6016ATC144-3N serves a distinct function in this setup, from interfacing with external signals to facilitating power and ground connections, underscoring the importance of meticulous configuration.

3. Enhancement of I/O and Peripheral Capabilities: The EPF6016ATC144-3N boasts a comprehensive suite of I/O functionalities, necessitating a deliberate approach to interface connection and configuration. The judicious allocation of I/O pins for operations such as communication and data transfer is crucial. This requires thoughtful planning in the PCB design to maintain signal integrity and minimize potential cross-talk and interference, especially crucial in scenarios involving rapid data exchange.

4. Memory Interface Arrangement: The EPF6016ATC144-3N's interaction with external memory modules, including ROM and RAM, is critical. This interaction is facilitated through a dedicated mapping of data, address, and control lines between the SoC and the memory units, using the SoC's specific memory interface pins. Proper setup of these interfaces significantly influences the system's overall performance, affecting everything from startup routines to application functionality.

5. Considerations for High-Speed Connectivity: For high-speed features like communication protocols and data transfer interfaces in the EPF6016ATC144-3N, not only is correct pin assignment vital but also adherence to PCB design principles that guarantee consistent and reliable operation. This encompasses strategies for differential signal routing, impedance control, and grounding practices essential for preserving signal integrity across these high-speed connections.

6. Management of Thermal and Power Stability: Given the EPF6016ATC144-3N's extensive capabilities within a compact integration, addressing thermal management and power stability is essential. Employing decoupling capacitors near power pins and implementing thermal dissipation strategies, such as heatsinks or thermal vias, is imperative for sustaining the SoC's operational stability and durability.

7. Comprehensive System Design and Integration Strategy: Incorporating the EPF6016ATC144-3N into an embedded system design demands an all-encompassing strategy that includes selecting suitable external components, precise PCB layout for signal integrity, and a thorough firmware development plan. This strategy ensures that the SoC can effectively utilize its resources, optimizing the system's functionality and performance.

The EPF6016ATC144-3N, through its potent combination of reconfigurable logic elements and extensive peripheral set, lays a solid foundation for the development of advanced digital systems. While integrating this SoC into a project requires diligent planning and attention to detail, it unlocks the potential for crafting highly efficient, multifunctional products poised to meet the varied demands of the modern technological landscape. Through meticulous design and strategic implementation, the EPF6016ATC144-3N enables developers to push the boundaries of embedded computing, fostering innovation and efficiency across numerous applications.

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6. What is the process for return or replacement of EPF6016ATC144-3N?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

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