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Name: EPF6016AFC256-2
Brand: Intel
SKU: EPF6016AFC256-2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EPF6016AFC256-2

Part No.:: EPF6016AFC256-2

Manufacturer:: Intel

Package:: 256-BGA

Datasheet:: EPF6016AFC256-2.pdf

Description:: IC FPGA 171 I/O 256FBGA

In Stock:: 3284

Quantity:: Add To Cart

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EPF6016AFC256-2 Specifications

Package/Case:
256-BGA
Packaging:
Tray
Series:
FLEX 6000
ProductStatus:
Obsolete
NumberofLABs/CLBs:
132
NumberofLogicElements/Cells:
1320
TotalRAMBits:
-
NumberofI/O:
171
NumberofGates:
16000
Voltage-Supply:
3V ~ 3.6V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

EPF6016AFC256-2 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EPF6016AFC256-2 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EPF6016AFC256-2 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EPF6016AFC256-2 information

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EPF6016AFC256-2 performance and reliability evaluation in extreme environments

EPF6016AFC256-2 is a field-programmable gate array (FPGA) device manufactured by Altera (now part of Intel) with a 256-pin Fine-Pitch Ball Grid Array (FPBGA) package. This FPGA offers high-density programmable logic, high-performance input/output (I/O) capabilities, and on-chip memory resources, making it suitable for a wide range of applications in sectors such as aerospace, automotive, telecommunications, and industrial automation.

Environmental Considerations:

In designing EPF6016AFC256-2 for extreme environmental conditions, several factors must be taken into account to ensure its reliability and performance:

- Temperature: The FPGA must operate reliably within specified temperature ranges, which may vary depending on the application. Adequate thermal management techniques such as heat sinks, fans, or thermal vias in the PCB layout should be employed to prevent overheating or thermal stress.

- Humidity: High levels of humidity can lead to corrosion or electrical short circuits. Encapsulation or conformal coating of the FPGA and surrounding components can protect against moisture ingress and ensure long-term reliability.

- Vibration and Mechanical Shock: In applications subject to vibration or mechanical shock, such as automotive or aerospace systems, the FPGA package and PCB mounting must withstand these stresses. Proper mechanical design, including securing the FPGA with shock-absorbing materials or vibration-damping mounts, is crucial.

- Chemical Exposure: Exposure to chemicals or harsh environmental contaminants can degrade the performance and reliability of the FPGA. Selecting materials and coatings resistant to chemicals, as well as sealing sensitive areas, can mitigate these risks.

Performance Analysis:

Despite the challenges posed by extreme environmental conditions, EPF6016AFC256-2 demonstrates robust performance and reliability in real-world applications. For example, in aerospace systems, where temperature variations and mechanical stresses are common, this FPGA reliably handles critical tasks such as flight control, navigation, and communication.

In automotive applications, EPF6016AFC256-2 serves as the brain of advanced driver assistance systems (ADAS), managing sensor data processing, decision-making algorithms, and actuator control even in harsh operating environments with temperature fluctuations and vibration.

In industrial automation, where moisture, dust, and temperature extremes are prevalent, EPF6016AFC256-2 powers programmable logic controllers (PLCs) and motion control systems, providing high-speed processing and precise I/O control to optimize manufacturing processes.

Overall, EPF6016AFC256-2 exemplifies resilience and versatility, meeting the demanding requirements of diverse applications in extreme environmental conditions while delivering high performance, reliability, and flexibility.

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6. What is the process for return or replacement of EPF6016AFC256-2?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EPF6016AFC256-2 we delivered, we will accept the replacement or return of the EPF6016AFC256-2 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EPF6016AFC256-2.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations