What is the Additional Feature ?

Name: EP3SL70F780C2N
Brand: Intel
SKU: EP3SL70F780C2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP3SL70F780C2N

Part No.:: EP3SL70F780C2N

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: EP3SL70F780C2N.pdf

Description:: IC FPGA 488 I/O 780FBGA

In Stock:: 2341

Quantity:: Add To Cart

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EP3SL70F780C2N Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® III L
ProductStatus:
Obsolete
NumberofLABs/CLBs:
2700
NumberofLogicElements/Cells:
67500
TotalRAMBits:
2699264
NumberofI/O:
488
NumberofGates:
-
Voltage-Supply:
0.86V ~ 1.15V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

EP3SL70F780C2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP3SL70F780C2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP3SL70F780C2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP3SL70F780C2N information

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EP3SL70F780C2N Application Introduction

EP3SL70F780C2N is a high-performance FPGA (Field-Programmable Gate Array) chip designed by Intel (formerly Altera), offering versatile programmability and integrated features suitable for various embedded system applications.

Application Scenario:

In digital signal processing applications, EP3SL70F780C2N can be utilized to implement complex algorithms for image processing, audio processing, and communications systems.

Circuit Design:

To effectively utilize EP3SL70F780C2N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization and minimize power consumption. Utilize voltage regulators, power gating, and dynamic voltage and frequency scaling (DVFS) to adapt power supply levels based on the FPGA's workload and operating conditions.

2. Signal Integrity:

Ensure robust signal integrity by carefully designing the PCB layout, minimizing signal crosstalk, and utilizing impedance-matched transmission lines. Pay special attention to high-speed interfaces, such as DDR memory interfaces, to minimize signal reflections and ensure reliable data transmission.

3. Thermal Management:

Manage thermal performance effectively to prevent overheating and ensure reliable operation of EP3SL70F780C2N. Utilize thermal vias, heat sinks, and fans to dissipate heat generated during FPGA operation. Additionally, consider implementing thermal monitoring and throttling mechanisms to dynamically adjust FPGA performance based on temperature conditions.

4. Clocking Architecture:

Design a robust clocking architecture to ensure accurate and stable timing for synchronous FPGA operation. Utilize PLLs (Phase-Locked Loops) and clock distribution networks to generate and distribute clock signals with minimal jitter and skew. Implement clock domain crossing techniques, such as FIFOs (First-In-First-Out buffers) and asynchronous clock domain crossing circuits, to synchronize signals between different clock domains.

5. Design Partitioning:

Partition the FPGA design into manageable blocks to facilitate design, verification, and debugging. Utilize hierarchical design methodologies to organize the design hierarchy and promote design reuse. Consider using intellectual property (IP) cores and pre-designed modules to accelerate development and reduce time-to-market.

Considerations:

When designing with EP3SL70F780C2N, it's essential to consider:

- Resource Utilization: Optimize FPGA resource utilization by minimizing logic duplication, maximizing parallelism, and efficiently utilizing memory resources.

- Design Constraints: Adhere to timing, area, and power constraints specified by the FPGA datasheet and design tools. Perform thorough timing analysis and optimization to meet timing closure requirements.

- Design Verification: Conduct comprehensive design verification using simulation, emulation, and hardware testing techniques to ensure functional correctness and robustness of the FPGA design.

- Design Security: Implement security measures, such as bitstream encryption and authentication, to protect the FPGA design from unauthorized access and tampering.

- Design Documentation: Maintain thorough documentation of the FPGA design, including design specifications, constraints, test plans, and implementation details, to facilitate design maintenance and future revisions.

EP3SL70F780C2N FAQ

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3. Are the EP3SL70F780C2N price and inventory displayed accurate?

The price and inventory of EP3SL70F780C2N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of EP3SL70F780C2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP3SL70F780C2N we delivered, we will accept the replacement or return of the EP3SL70F780C2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP3SL70F780C2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations