What is the Additional Feature ?

Name: EP3SL50F780I4
Brand: Intel
SKU: EP3SL50F780I4
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP3SL50F780I4

Part No.:: EP3SL50F780I4

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: EP3SL50F780I4.pdf

Description:: IC FPGA 488 I/O 780FBGA

In Stock:: 3349

Quantity:: Add To Cart

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EP3SL50F780I4 Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® III L
ProductStatus:
Obsolete
NumberofLABs/CLBs:
1900
NumberofLogicElements/Cells:
47500
TotalRAMBits:
2184192
NumberofI/O:
488
NumberofGates:
-
Voltage-Supply:
0.86V ~ 1.15V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

EP3SL50F780I4 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP3SL50F780I4 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP3SL50F780I4 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP3SL50F780I4 information

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The application and technological advancement of EP3SL50F780I4 in specific industries

EP3SL50F780I4 is a field-programmable gate array (FPGA) chip manufactured by Intel, offering high-performance and flexibility for a variety of applications in different industries.

Application Scenario:

In the aerospace industry, EP3SL50F780I4 finds extensive use in onboard systems of satellites and spacecraft, where reliability, radiation tolerance, and reconfigurability are paramount.

Circuit Design:

To incorporate EP3SL50F780I4 into an aerospace application, the following steps are typically taken:

1. System Architecture:

Define the system architecture and requirements, considering factors such as data processing, communication protocols, and fault tolerance. Determine the modules and interfaces required for the FPGA implementation.

2. IP Core Integration:

Integrate Intellectual Property (IP) cores for functions such as data encryption, signal processing, and communication protocols into the FPGA design. Customize and configure these cores to meet the specific requirements of the aerospace application.

3. Radiation Hardening:

Implement radiation-hardening techniques to mitigate the effects of ionizing radiation in the space environment. This may include using radiation-tolerant components, triple modular redundancy (TMR), and error correction codes (ECC) to enhance the reliability of the FPGA-based systems.

4. Test and Verification:

Conduct rigorous testing and verification of the FPGA design using simulation tools and hardware-in-the-loop (HIL) testing. Verify the functionality, performance, and reliability of the system under simulated space conditions.

5. Configuration and Deployment:

Program the EP3SL50F780I4 FPGA with the finalized design and deploy it into the target aerospace platform. Ensure proper configuration management and version control to facilitate future updates and maintenance.

Benefits:

The integration of EP3SL50F780I4 FPGA technology in aerospace applications offers several advantages:

- Flexibility: The reconfigurable nature of FPGAs allows for rapid prototyping and adaptation to evolving mission requirements.

- High Performance: FPGA-based systems can achieve high processing speeds and low latency, critical for real-time data processing and decision-making in space missions.

- Reliability: By implementing radiation-hardening techniques and redundancy schemes, FPGA-based systems can withstand the harsh radiation environment of space.

- Scalability: FPGAs offer scalability in terms of logic capacity and I/O capabilities, enabling the integration of additional functionalities and interfaces as needed.

- Cost Efficiency: FPGA-based solutions can offer cost savings compared to custom ASICs (Application-Specific Integrated Circuits) for low to medium volume production runs, thanks to their reusability and shorter time-to-market.

Conclusion:

EP3SL50F780I4 FPGA technology plays a pivotal role in advancing the capabilities of aerospace systems, enabling enhanced performance, reliability, and flexibility in satellite and spacecraft applications.

EP3SL50F780I4 FAQ

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3. Are the EP3SL50F780I4 price and inventory displayed accurate?

The price and inventory of EP3SL50F780I4 fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of EP3SL50F780I4?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP3SL50F780I4 we delivered, we will accept the replacement or return of the EP3SL50F780I4 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP3SL50F780I4.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations