What is the Additional Feature ?

Name: EP3SL50F780C2N
Brand: Intel
SKU: EP3SL50F780C2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP3SL50F780C2N

Part No.:: EP3SL50F780C2N

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: EP3SL50F780C2N.pdf

Description:: IC FPGA 488 I/O 780FBGA

In Stock:: 2132

Quantity:: Add To Cart

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EP3SL50F780C2N Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® III L
ProductStatus:
Obsolete
NumberofLABs/CLBs:
1900
NumberofLogicElements/Cells:
47500
TotalRAMBits:
2184192
NumberofI/O:
488
NumberofGates:
-
Voltage-Supply:
0.86V ~ 1.15V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

EP3SL50F780C2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP3SL50F780C2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP3SL50F780C2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP3SL50F780C2N information

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EP3SL50F780C2N Application Introduction

EP3SL50F780C2N is a Field-Programmable Gate Array (FPGA) chip manufactured by Intel, featuring high logic capacity and versatile functionality, commonly used in a variety of electronic design projects.

Application Scope:

In digital system design, EP3SL50F780C2N can be utilized for implementing complex logic functions, signal processing, and control algorithms in applications such as communication systems, industrial automation, and embedded computing platforms.

Design Optimization:

To effectively utilize EP3SL50F780C2N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization and minimize power consumption of the EP3SL50F780C2N FPGA and associated circuitry. Utilize low-dropout voltage regulators and power-saving modes to achieve energy efficiency.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal distortion, reflections, and crosstalk. Follow best practices for high-speed digital design, such as impedance matching, controlled impedance routing, and proper grounding techniques, to maintain signal integrity and reduce noise interference.

3. Thermal Management:

Ensure effective thermal dissipation to prevent overheating of the EP3SL50F780C2N FPGA, which can degrade performance and reliability. Incorporate heatsinks, thermal vias, and adequate ventilation in the PCB layout to dissipate heat efficiently and maintain operational temperature within safe limits.

4. Clock Distribution:

Optimize clock distribution to ensure stable and reliable operation of the FPGA. Use dedicated clock networks, clock buffers, and phase-locked loops (PLLs) to generate and distribute clock signals with minimal skew and jitter, ensuring synchronous operation of the design.

5. Design Partitioning:

Break down the design into manageable modules and partitions to facilitate efficient implementation and debugging. Use hierarchical design techniques to organize the design hierarchy and promote reusability of IP cores and modules, optimizing resource utilization and design scalability.

Considerations:

When designing with EP3SL50F780C2N, it's essential to consider:

- Resource Utilization: Optimize FPGA resource allocation and utilization to maximize design efficiency and minimize resource constraints.

- Timing Closure: Perform timing analysis and optimization to meet the design's performance requirements and ensure timing closure within the specified constraints.

- Design Verification: Thoroughly verify the design through simulation, emulation, and hardware testing to validate functionality, performance, and reliability before deployment.

- Design Security: Implement security measures such as bitstream encryption, device locking, and secure boot to protect intellectual property and prevent unauthorized access or tampering of the FPGA design.

EP3SL50F780C2N FAQ

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3. Are the EP3SL50F780C2N price and inventory displayed accurate?

The price and inventory of EP3SL50F780C2N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of EP3SL50F780C2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP3SL50F780C2N we delivered, we will accept the replacement or return of the EP3SL50F780C2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP3SL50F780C2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations