What is the Additional Feature ?

Name: EP3SL50F780C2
Brand: Intel
SKU: EP3SL50F780C2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP3SL50F780C2

Part No.:: EP3SL50F780C2

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: EP3SL50F780C2.pdf

Description:: IC FPGA 488 I/O 780FBGA

In Stock:: 3130

Quantity:: Add To Cart

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EP3SL50F780C2 Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® III L
ProductStatus:
Obsolete
NumberofLABs/CLBs:
1900
NumberofLogicElements/Cells:
47500
TotalRAMBits:
2184192
NumberofI/O:
488
NumberofGates:
-
Voltage-Supply:
0.86V ~ 1.15V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

EP3SL50F780C2 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP3SL50F780C2 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP3SL50F780C2 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP3SL50F780C2 information

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EP3SL50F780C2 Application Introduction

EP3SL50F780C2 is a high-performance FPGA (Field-Programmable Gate Array) chip manufactured by Intel, offering versatile functionality and flexibility for a wide range of digital design projects.

Application Scenario:

In digital signal processing applications, EP3SL50F780C2 can be utilized to implement complex algorithms for tasks such as image processing, audio processing, and communications.

Circuit Design:

To effectively use EP3SL50F780C2 in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization and prolong the battery life of portable devices. Utilize low-power modes and dynamic voltage scaling features of EP3SL50F780C2 to minimize power consumption during idle or low activity periods.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal degradation and electromagnetic interference. Utilize proper termination techniques, impedance matching, and signal routing guidelines to maintain signal integrity and prevent data corruption in high-speed interfaces connected to EP3SL50F780C2.

3. Thermal Management:

Ensure adequate thermal dissipation for EP3SL50F780C2 to prevent overheating and ensure reliable operation. Incorporate heat sinks, thermal vias, and airflow optimization in the system design to dissipate heat effectively and maintain the FPGA's temperature within safe operating limits.

4. Design Partitioning:

Partition the design into logical modules and utilize the resources of EP3SL50F780C2 efficiently. Distribute computational tasks across FPGA resources, such as DSP blocks and logic elements, to maximize performance and resource utilization.

5. Timing Closure:

Perform timing analysis and optimization to ensure that the design meets the required timing constraints. Utilize tools and techniques, such as pipelining, retiming, and clock domain crossing synchronization, to achieve timing closure and improve the overall system performance of EP3SL50F780C2-based designs.

Considerations:

When designing with EP3SL50F780C2, it's essential to consider:

- Resource Utilization: Optimize resource usage to maximize the functionality and performance of the FPGA-based design while minimizing resource conflicts and bottlenecks.

- Design Flexibility: Leverage the reconfigurability of EP3SL50F780C2 to adapt to changing project requirements and accommodate future design iterations or upgrades.

- Verification and Testing: Thoroughly verify and test the design to ensure functional correctness, reliability, and compliance with project specifications and standards.

- Design Documentation: Maintain comprehensive documentation of the design, including schematics, HDL code, timing constraints, and design constraints, to facilitate design understanding, collaboration, and future maintenance.

EP3SL50F780C2 FAQ

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3. Are the EP3SL50F780C2 price and inventory displayed accurate?

The price and inventory of EP3SL50F780C2 fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of EP3SL50F780C2?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP3SL50F780C2 we delivered, we will accept the replacement or return of the EP3SL50F780C2 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP3SL50F780C2.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations