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Name: EP3SL340H1152C2N
Brand: Intel
SKU: EP3SL340H1152C2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP3SL340H1152C2N

Part No.:: EP3SL340H1152C2N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: EP3SL340H1152C2N.pdf

Description:: IC FPGA 744 I/O 1152HBGA

In Stock:: 2397

Quantity:: Add To Cart

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EP3SL340H1152C2N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® III L
ProductStatus:
Obsolete
NumberofLABs/CLBs:
13500
NumberofLogicElements/Cells:
337500
TotalRAMBits:
18822144
NumberofI/O:
744
NumberofGates:
-
Voltage-Supply:
0.86V ~ 1.15V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

EP3SL340H1152C2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP3SL340H1152C2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP3SL340H1152C2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP3SL340H1152C2N information

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EP3SL340H1152C2N Application Introduction

EP3SL340H1152C2N is a field-programmable gate array (FPGA) device manufactured by Intel, offering high performance and flexibility for various design applications.

Application Scenario:

In digital signal processing and telecommunications, EP3SL340H1152C2N can be utilized to implement complex algorithms and signal processing tasks efficiently.

Circuit Design:

To effectively utilize EP3SL340H1152C2N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to optimize power consumption and ensure stable operation of EP3SL340H1152C2N. Utilize low-dropout voltage regulators and power sequencing circuits to provide clean and stable power to the FPGA and associated components.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and other sources of noise that could degrade signal integrity. Use proper termination techniques, controlled impedance traces, and ground planes to maintain signal integrity and prevent data errors.

3. Thermal Management:

Ensure adequate thermal dissipation for EP3SL340H1152C2N to prevent overheating and ensure reliable operation. Incorporate heat sinks, thermal vias, and airflow management in the system design to dissipate heat effectively and maintain optimal operating temperatures.

4. Clock Distribution:

Optimize clock distribution to minimize clock skew and jitter, ensuring synchronous operation of the FPGA and associated components. Use dedicated clock networks, clock buffers, and phase-locked loops (PLLs) to generate and distribute clock signals with low skew and jitter.

5. I/O Planning:

Carefully plan the I/O assignments and constraints to optimize pin utilization and maximize performance. Group related I/O signals, use differential signaling where necessary, and apply proper I/O standards to meet timing requirements and ensure signal integrity.

Considerations:

When designing with EP3SL340H1152C2N, keep the following considerations in mind:

- Resource Utilization: Efficiently utilize FPGA resources, such as logic cells, memory blocks, and DSP slices, to maximize performance and minimize resource wastage.

- Timing Closure: Perform thorough timing analysis and optimization to ensure timing closure and meet design requirements, considering factors like clock frequency, propagation delays, and setup/hold times.

- Design Validation: Validate the design through simulation, emulation, and prototype testing to verify functionality, performance, and reliability before deployment.

- Design Security: Implement security measures, such as bitstream encryption and authentication, to protect intellectual property and prevent unauthorized access or tampering with the FPGA configuration.

- Future Expansion: Design the system with scalability and flexibility in mind to accommodate future upgrades or modifications, considering factors like interface compatibility, resource scalability, and design reuse.

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3. Are the EP3SL340H1152C2N price and inventory displayed accurate?

The price and inventory of EP3SL340H1152C2N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of EP3SL340H1152C2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP3SL340H1152C2N we delivered, we will accept the replacement or return of the EP3SL340H1152C2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP3SL340H1152C2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations