What is the Additional Feature ?

Name: EP3SL200H780I3
Brand: Intel
SKU: EP3SL200H780I3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP3SL200H780I3

Part No.:: EP3SL200H780I3

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: EP3SL200H780I3.pdf

Description:: IC FPGA 488 I/O 780HBGA

In Stock:: 3257

Quantity:: Add To Cart

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EP3SL200H780I3 Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® III L
ProductStatus:
Obsolete
NumberofLABs/CLBs:
8000
NumberofLogicElements/Cells:
200000
TotalRAMBits:
10901504
NumberofI/O:
488
NumberofGates:
-
Voltage-Supply:
0.86V ~ 1.15V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

EP3SL200H780I3 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP3SL200H780I3 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP3SL200H780I3 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP3SL200H780I3 information

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The application and technological advancement of EP3SL200H780I3 in specific industries

EP3SL200H780I3 is a field-programmable gate array (FPGA) chip manufactured by Intel. It offers high-performance logic and memory capabilities, making it suitable for a wide range of applications across various industries.

Application Scenario:

In the telecommunications sector, EP3SL200H780I3 plays a pivotal role in the development of next-generation network infrastructure. Its customizable architecture allows for the implementation of complex signal processing algorithms and high-speed data transmission protocols.

Circuit Design:

To harness the power of EP3SL200H780I3 in telecommunications applications, consider the following design considerations:

1. Protocol Implementation:

Utilize the FPGA's resources to implement communication protocols such as Ethernet, SONET/SDH, or emerging standards like 5G NR (New Radio). Customize the protocol stack according to the specific requirements of the telecommunications network.

2. Signal Processing:

Implement signal processing algorithms for functions such as error correction, encryption, and modulation/demodulation. Leverage the FPGA's parallel processing capabilities to handle high-volume data streams efficiently.

3. Interface Integration:

Integrate various interface standards, including PCIe, USB, and JTAG, to facilitate communication with external devices and debugging tools. Customize the interface configurations to ensure seamless interoperability within the telecommunications ecosystem.

4. Power Optimization:

Implement power-saving techniques, such as dynamic voltage and frequency scaling (DVFS) and clock gating, to optimize energy efficiency without compromising performance. Design power delivery networks with adequate decoupling capacitors and voltage regulators to ensure stable operation.

5. Real-Time Monitoring:

Integrate monitoring and diagnostic capabilities into the FPGA design to facilitate real-time performance analysis and fault detection. Implement on-chip monitoring circuits to track key metrics such as temperature, voltage, and utilization.

Impact on Industry Standards:

The adoption of EP3SL200H780I3 in telecommunications infrastructure has redefined industry standards by enabling the development of highly flexible and scalable network equipment. Its programmable nature allows for rapid prototyping and deployment of innovative solutions, driving the evolution of telecommunications technologies.

Enhanced Technical Competence:

By leveraging the capabilities of EP3SL200H780I3, telecommunications engineers can push the boundaries of performance and efficiency in network design and operation. The FPGA's versatility empowers developers to implement advanced features and adapt to evolving market demands, thereby raising the technical proficiency of the industry as a whole.

EP3SL200H780I3 FAQ

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3. Are the EP3SL200H780I3 price and inventory displayed accurate?

The price and inventory of EP3SL200H780I3 fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of EP3SL200H780I3?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP3SL200H780I3 we delivered, we will accept the replacement or return of the EP3SL200H780I3 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP3SL200H780I3.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations