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Name: EP3SL200F1517C4L
Brand: Intel
SKU: EP3SL200F1517C4L
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP3SL200F1517C4L

Part No.:: EP3SL200F1517C4L

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: EP3SL200F1517C4L.pdf

Description:: IC FPGA 976 I/O 1517FBGA

In Stock:: 3552

Quantity:: Add To Cart

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EP3SL200F1517C4L Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® III L
ProductStatus:
Obsolete
NumberofLABs/CLBs:
8000
NumberofLogicElements/Cells:
200000
TotalRAMBits:
10901504
NumberofI/O:
976
NumberofGates:
-
Voltage-Supply:
0.86V ~ 1.15V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

EP3SL200F1517C4L this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP3SL200F1517C4L price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP3SL200F1517C4L to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP3SL200F1517C4L information

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EP3SL200F1517C4L Application Introduction

EP3SL200F1517C4L is a field-programmable gate array (FPGA) chip known for its versatility and performance, commonly used in various electronic design projects.

Application Overview:

In electronic design projects, EP3SL200F1517C4L can be utilized for tasks such as digital signal processing, high-speed data processing, and hardware acceleration in applications ranging from telecommunications to image processing.

Design Optimization:

To effectively utilize EP3SL200F1517C4L in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure stable and reliable operation of EP3SL200F1517C4L and associated peripherals. Utilize voltage regulators, power sequencing, and power-saving modes to minimize power consumption and prolong battery life if applicable.

2. Signal Integrity:

Pay close attention to signal integrity to maintain reliable communication and avoid data errors. Proper PCB layout design, impedance matching, and signal termination techniques should be employed to mitigate signal integrity issues and ensure optimal performance of EP3SL200F1517C4L-based designs.

3. Thermal Management:

Manage thermal dissipation effectively to prevent overheating and ensure long-term reliability of EP3SL200F1517C4L. Adequate heat sinking, thermal vias, and airflow design should be considered to maintain optimal operating temperatures and prevent thermal-induced failures.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and synchronized clock signals to EP3SL200F1517C4L and other critical components. Proper clock routing, clock tree synthesis, and clock skew optimization techniques should be employed to minimize jitter and ensure timing accuracy.

5. Design Partitioning:

Partition the design into manageable modules to facilitate design reuse, testing, and verification. Utilize hierarchical design methodologies, IP cores, and standardized interfaces to improve design scalability, maintainability, and productivity when working with EP3SL200F1517C4L.

Considerations:

When designing with EP3SL200F1517C4L, it's important to consider:

- Resource Utilization: Optimize resource utilization to maximize FPGA performance and minimize resource contention.

- Design Constraints: Adhere to design constraints such as timing requirements, resource constraints, and pin assignments to ensure successful implementation and timing closure.

- Design Validation: Thoroughly validate the design through simulation, emulation, and prototype testing to ensure functionality, performance, and reliability before deployment.

- Future Scalability: Design the system with future scalability in mind, considering potential upgrades, expansions, and evolving project requirements.

- Documentation: Maintain comprehensive documentation of the design, including schematics, design constraints, test plans, and implementation details, to facilitate collaboration, troubleshooting, and future modifications.

EP3SL200F1517C4L FAQ

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3. Are the EP3SL200F1517C4L price and inventory displayed accurate?

The price and inventory of EP3SL200F1517C4L fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of EP3SL200F1517C4L?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP3SL200F1517C4L we delivered, we will accept the replacement or return of the EP3SL200F1517C4L only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP3SL200F1517C4L.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations