What is the Additional Feature ?

Name: EP3SL200F1152C3
Brand: Intel
SKU: EP3SL200F1152C3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP3SL200F1152C3

Part No.:: EP3SL200F1152C3

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: EP3SL200F1152C3.pdf

Description:: IC FPGA 744 I/O 1152FBGA

In Stock:: 3520

Quantity:: Add To Cart

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EP3SL200F1152C3 Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® III L
ProductStatus:
Obsolete
NumberofLABs/CLBs:
8000
NumberofLogicElements/Cells:
200000
TotalRAMBits:
10901504
NumberofI/O:
744
NumberofGates:
-
Voltage-Supply:
0.86V ~ 1.15V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

EP3SL200F1152C3 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP3SL200F1152C3 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP3SL200F1152C3 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP3SL200F1152C3 information

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EP3SL200F1152C3 Application Introduction

EP3SL200F1152C3 is a field-programmable gate array (FPGA) device manufactured by Intel (formerly Altera), offering high performance and flexibility for various digital design applications.

Application Overview:

In digital design projects, EP3SL200F1152C3 can be effectively utilized for tasks such as signal processing, encryption, data acceleration, and more.

Design Optimization:

To optimize the design using EP3SL200F1152C3, consider the following key aspects:

1. Power Management:

Implement efficient power management techniques to ensure stable and reliable operation of EP3SL200F1152C3 and associated components. Utilize voltage regulators, power monitoring circuits, and proper decoupling capacitors to minimize noise and maintain voltage integrity.

2. Signal Integrity:

Pay attention to signal integrity throughout the design process to prevent issues such as signal distortion, crosstalk, and jitter. Proper PCB layout, impedance matching, and signal termination techniques should be employed to maintain signal integrity and maximize performance.

3. Thermal Management:

Manage heat dissipation effectively to prevent thermal issues that could affect the performance and reliability of EP3SL200F1152C3. Utilize heat sinks, thermal vias, and proper airflow design to dissipate heat efficiently and maintain optimal operating temperatures.

4. Design Partitioning:

Partition the design into manageable modules to facilitate development, testing, and debugging. Identify critical modules and optimize their implementation for performance, resource utilization, and ease of integration within the overall system.

5. Clock Management:

Proper clock management is crucial for ensuring synchronous operation and minimizing timing-related issues. Implement clock distribution networks, clock domain crossing techniques, and clock skew mitigation strategies to optimize timing performance and reliability.

Additional Considerations:

When designing with EP3SL200F1152C3, keep in mind:

- Resource Utilization: Optimize resource utilization to maximize the functionality and efficiency of the FPGA design.

- Design Constraints: Adhere to design constraints such as timing requirements, resource limitations, and power budgets to ensure design success and meet project objectives.

- Design Validation: Thoroughly validate the design through simulation, emulation, and prototyping to verify functionality, performance, and compliance with specifications.

- Documentation: Maintain comprehensive documentation throughout the design process to facilitate collaboration, troubleshooting, and future maintenance.

- Continuous Improvement: Continuously evaluate and refine the design to address any issues, optimize performance, and incorporate new requirements or enhancements.

EP3SL200F1152C3 FAQ

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3. Are the EP3SL200F1152C3 price and inventory displayed accurate?

The price and inventory of EP3SL200F1152C3 fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of EP3SL200F1152C3?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP3SL200F1152C3 we delivered, we will accept the replacement or return of the EP3SL200F1152C3 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP3SL200F1152C3.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations