What is the Additional Feature ?

Name: EP3SL150F780C4L
Brand: Intel
SKU: EP3SL150F780C4L
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP3SL150F780C4L

Part No.:: EP3SL150F780C4L

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: EP3SL150F780C4L.pdf

Description:: IC FPGA 488 I/O 780FBGA

In Stock:: 3709

Quantity:: Add To Cart

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EP3SL150F780C4L Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® III L
ProductStatus:
Obsolete
NumberofLABs/CLBs:
5700
NumberofLogicElements/Cells:
142500
TotalRAMBits:
6543360
NumberofI/O:
488
NumberofGates:
-
Voltage-Supply:
0.86V ~ 1.15V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

EP3SL150F780C4L this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP3SL150F780C4L price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP3SL150F780C4L to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP3SL150F780C4L information

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EP3SL150F780C4L Application Introduction

EP3SL150F780C4L is a high-performance FPGA (Field-Programmable Gate Array) chip manufactured by Intel (formerly Altera), commonly used in various digital design projects for its versatility and processing capabilities.

Application Scenario:

In digital signal processing applications, EP3SL150F780C4L can be utilized to implement complex algorithms for tasks such as image processing, audio filtering, and communication protocols.

Design Optimization:

To effectively utilize EP3SL150F780C4L in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization and prolong the lifespan of EP3SL150F780C4L. Utilize power gating, voltage scaling, and dynamic power management strategies to minimize power consumption during idle and low activity periods.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues such as noise, crosstalk, and signal reflections. Use proper impedance matching techniques, controlled impedance traces, and signal termination resistors to maintain signal integrity and prevent data errors.

3. Thermal Management:

Implement effective thermal management solutions to prevent overheating and ensure reliable operation of EP3SL150F780C4L under high workload conditions. Utilize heat sinks, thermal vias, and fans to dissipate heat efficiently and maintain the FPGA chip's operating temperature within safe limits.

4. Clock Distribution:

Design a robust clock distribution network to ensure stable and accurate clock signals are delivered to EP3SL150F780C4L and associated peripherals. Use low-skew clock distribution techniques, clock buffers, and PLLs (Phase-Locked Loops) to minimize clock jitter and maintain synchronization across the system.

5. I/O Interface:

Optimize the I/O interface design to maximize data throughput and minimize latency. Utilize high-speed transceivers, SERDES (Serializer/Deserializer) channels, and LVDS (Low-Voltage Differential Signaling) interfaces for high-speed data communication between EP3SL150F780C4L and external devices or memory modules.

Considerations:

When designing with EP3SL150F780C4L, it's essential to consider:

- Resource Utilization: Optimize FPGA resource utilization by carefully mapping and placing logic elements, memory blocks, and DSP (Digital Signal Processing) slices to maximize performance and minimize resource wastage.

- Timing Closure: Perform thorough timing analysis and optimization to ensure all timing constraints are met and avoid timing violations that can lead to functionality errors or reduced performance.

- Design Modularity: Partition the design into modular blocks and use hierarchical design methodologies to facilitate easier debugging, testing, and maintenance of the FPGA design project.

- Security Considerations: Implement security features such as bitstream encryption, secure boot mechanisms, and tamper detection to protect the intellectual property and sensitive data stored in EP3SL150F780C4L.

EP3SL150F780C4L FAQ

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3. Are the EP3SL150F780C4L price and inventory displayed accurate?

The price and inventory of EP3SL150F780C4L fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of EP3SL150F780C4L?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP3SL150F780C4L we delivered, we will accept the replacement or return of the EP3SL150F780C4L only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP3SL150F780C4L.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations