What is the Additional Feature ?

Name: EP3SL150F780C2G
Brand: Intel
SKU: EP3SL150F780C2G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP3SL150F780C2G

Part No.:: EP3SL150F780C2G

Manufacturer:: Intel

Package:: -

Datasheet:

Description:: IC FPGA 488 I/O 780FBGA

In Stock:: 2596

Quantity:: Add To Cart

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EP3SL150F780C2G Specifications

Package/Case:
-
Packaging:
Tray
Series:
*
ProductStatus:
Active
NumberofLABs/CLBs:
-
NumberofLogicElements/Cells:
-
TotalRAMBits:
-
NumberofI/O:
-
NumberofGates:
-
Voltage-Supply:
-
MountingType:
-
OperatingTemperature:
-

EP3SL150F780C2G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP3SL150F780C2G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP3SL150F780C2G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP3SL150F780C2G information

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EP3SL150F780C2G performance and reliability evaluation in extreme environments

EP3SL150F780C2G is an FPGA chip designed for high performance and reliability, often used in applications requiring robust environmental tolerance. It features advanced thermal management, low power consumption, and extensive I/O capabilities.

Environmental Considerations:

Designing systems with EP3SL150F780C2G requires careful consideration of environmental factors such as temperature and humidity.

1. High Temperature:

When operating in high-temperature environments, it's crucial to ensure adequate cooling mechanisms. Heat sinks and active cooling fans can be implemented to dissipate heat effectively. Additionally, the use of thermal interface materials can improve heat transfer between the chip and the cooling solution.

2. Low Temperature:

In low-temperature conditions, maintaining proper operation involves ensuring that the materials and components used do not become brittle. Conformal coatings can protect the FPGA from moisture and condensation that might occur during temperature fluctuations.

3. Humidity:

To safeguard against high humidity, it's essential to use moisture-resistant packaging and conformal coatings. These measures help prevent corrosion and electrical shorts caused by condensation.

Performance Analysis:

In practical applications, EP3SL150F780C2G has demonstrated reliable performance across various environmental conditions. Stress testing under extreme temperatures and humidity has shown that the chip maintains its functionality without significant degradation.

1. Thermal Management:

The chip's design includes advanced thermal management features, allowing it to operate efficiently even in high-temperature environments. This includes the use of low-power transistors and optimized power distribution networks to minimize heat generation.

2. Material Selection:

Using high-quality materials in the manufacturing process ensures that EP3SL150F780C2G remains reliable in low temperatures. The materials are selected to withstand thermal expansion and contraction, reducing the risk of mechanical failures.

3. Protective Coatings:

Applying conformal coatings and using moisture-resistant materials in the packaging process help protect the FPGA from humidity-related issues. These coatings prevent moisture ingress, ensuring long-term reliability in humid environments.

Application Example:

In aerospace applications, where extreme temperatures and humidity variations are common, EP3SL150F780C2G is used in control systems that require high reliability. The chip's robust design ensures consistent performance, contributing to the overall reliability of the aerospace systems.

Conclusion:

The careful consideration of environmental factors in the design and testing phases ensures that EP3SL150F780C2G performs reliably in extreme conditions. By implementing appropriate thermal management, material selection, and protective coatings, the chip remains a dependable choice for applications in harsh environments.

EP3SL150F780C2G FAQ

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We have a professional and experienced quality control team to strictly verify and test the EP3SL150F780C2G. All suppliers must pass our qualification reviews before they can publish their products including EP3SL150F780C2G on icwhale.com; we pay more attention to the channels and quality of EP3SL150F780C2G products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.

3. Are the EP3SL150F780C2G price and inventory displayed accurate?

The price and inventory of EP3SL150F780C2G fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

4. What forms of payment are accepted?

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of EP3SL150F780C2G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP3SL150F780C2G we delivered, we will accept the replacement or return of the EP3SL150F780C2G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP3SL150F780C2G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations