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Name: EP3SL150F1152C4L
Brand: Intel
SKU: EP3SL150F1152C4L
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP3SL150F1152C4L

Part No.:: EP3SL150F1152C4L

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: EP3SL150F1152C4L.pdf

Description:: IC FPGA 744 I/O 1152FBGA

In Stock:: 3810

Quantity:: Add To Cart

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EP3SL150F1152C4L Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® III L
ProductStatus:
Obsolete
NumberofLABs/CLBs:
5700
NumberofLogicElements/Cells:
142500
TotalRAMBits:
6543360
NumberofI/O:
744
NumberofGates:
-
Voltage-Supply:
0.86V ~ 1.15V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

EP3SL150F1152C4L this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP3SL150F1152C4L price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP3SL150F1152C4L to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP3SL150F1152C4L information

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EP3SL150F1152C4L Application Introduction

EP3SL150F1152C4L is a high-performance FPGA (Field Programmable Gate Array) chip manufactured by Intel (formerly Altera), offering versatile functionality and flexibility for a wide range of digital design projects.

Application Scenario:

In digital signal processing applications, EP3SL150F1152C4L can be utilized to implement complex algorithms for tasks such as image processing, audio processing, or wireless communication protocols.

Circuit Design:

To effectively utilize EP3SL150F1152C4L in a design project, consider the following steps:

1. Power Management:

Ensure a robust power supply system to provide stable voltage levels to EP3SL150F1152C4L and associated components. Utilize voltage regulators, decoupling capacitors, and proper grounding techniques to minimize noise and ensure reliable operation.

2. Signal Integrity:

Implement signal integrity measures such as impedance matching, controlled impedance routing, and proper termination techniques to maintain signal integrity and reduce signal distortion in high-speed interfaces connected to EP3SL150F1152C4L.

3. Thermal Management:

Manage heat dissipation effectively to prevent EP3SL150F1152C4L from overheating, which can degrade performance and reliability. Utilize heat sinks, thermal vias, and proper airflow in the design to dissipate heat efficiently.

4. Clock Distribution:

Design a robust clock distribution network to ensure stable and synchronized clock signals for EP3SL150F1152C4L and associated modules. Use low-skew clock distribution techniques and minimize clock signal skew to optimize system performance.

5. I/O Planning:

Carefully plan and optimize the I/O (input/output) placement and routing to minimize signal routing delays and ensure efficient communication between EP3SL150F1152C4L and external devices or modules. Use differential signaling and proper termination to mitigate signal noise and improve reliability.

Considerations:

When designing with EP3SL150F1152C4L, it's essential to consider:

- Resource Utilization: Optimize resource utilization by carefully selecting FPGA resources and efficiently mapping the design onto the device to maximize performance and minimize resource usage.

- Design Constraints: Take into account timing constraints, routing constraints, and other design constraints to ensure the design meets performance requirements and operates reliably under all operating conditions.

- Design Validation: Perform thorough testing and verification of the design to validate functionality, performance, and reliability before deployment. Use simulation tools, hardware testing, and debugging techniques to identify and resolve any issues early in the design process.

- Future Scalability: Design the system with scalability in mind to accommodate future enhancements or upgrades. Plan for expansion ports, modular interfaces, and flexible architectures to facilitate future modifications or additions to the system.

- Documentation: Maintain comprehensive documentation throughout the design process, including design specifications, schematics, layout files, and test reports, to aid in design review, troubleshooting, and future maintenance.

EP3SL150F1152C4L FAQ

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3. Are the EP3SL150F1152C4L price and inventory displayed accurate?

The price and inventory of EP3SL150F1152C4L fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of EP3SL150F1152C4L?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP3SL150F1152C4L we delivered, we will accept the replacement or return of the EP3SL150F1152C4L only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP3SL150F1152C4L.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations