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Name: EP3SE50F484C4N
Brand: Intel
SKU: EP3SE50F484C4N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP3SE50F484C4N

Part No.:: EP3SE50F484C4N

Manufacturer:: Intel

Package:: 484-BBGA, FCBGA

Datasheet:: EP3SE50F484C4N.pdf

Description:: IC FPGA 296 I/O 484FBGA

In Stock:: 2192

Quantity:: Add To Cart

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EP3SE50F484C4N Specifications

Package/Case:
484-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® III E
ProductStatus:
Obsolete
NumberofLABs/CLBs:
1900
NumberofLogicElements/Cells:
47500
TotalRAMBits:
5760000
NumberofI/O:
296
NumberofGates:
-
Voltage-Supply:
0.86V ~ 1.15V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

EP3SE50F484C4N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP3SE50F484C4N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP3SE50F484C4N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP3SE50F484C4N information

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EP3SE50F484C4N Application Introduction

EP3SE50F484C4N is a field-programmable gate array (FPGA) chip manufactured by Intel, designed for high-performance applications requiring customizable logic and processing capabilities.

Application Scenario:

In digital signal processing (DSP) applications, EP3SE50F484C4N can be utilized to implement complex algorithms for tasks such as image processing or audio filtering.

Circuit Design:

To effectively utilize EP3SE50F484C4N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to optimize power consumption of EP3SE50F484C4N and associated peripherals. Utilize power gating, dynamic voltage scaling, and standby modes to minimize power usage during idle periods.

2. Signal Integrity:

Ensure signal integrity by carefully designing PCB layouts and signal routing. Minimize signal reflections, crosstalk, and impedance mismatches to maintain reliable communication between EP3SE50F484C4N and external components.

3. Thermal Management:

Implement effective thermal management strategies to prevent overheating of EP3SE50F484C4N during operation. Use heat sinks, thermal vias, and proper airflow within the enclosure to dissipate heat and maintain optimal operating temperatures.

4. Clock Distribution:

Design a robust clock distribution network to ensure stable clock signals throughout the FPGA and associated circuits. Use low-skew clock buffers, proper termination techniques, and clock tree synthesis to minimize clock jitter and skew.

5. Configuration Management:

Optimize FPGA configuration management to streamline the design process and improve system reliability. Utilize partial reconfiguration, configuration compression, and secure boot features to efficiently manage FPGA configurations and ensure system security.

Considerations:

When designing with EP3SE50F484C4N, it's important to consider:

- Resource Utilization: Efficiently utilize FPGA resources, such as logic elements, memory blocks, and DSP slices, to maximize performance and minimize area utilization.

- Timing Closure: Perform thorough timing analysis and optimization to ensure all timing constraints are met and critical paths are properly optimized for maximum performance.

- Design Verification: Conduct extensive simulation and verification testing to validate the functionality, performance, and reliability of the FPGA design under various operating conditions.

- Design Security: Implement security features, such as bitstream encryption and authentication, to protect the FPGA design from unauthorized access, tampering, or reverse engineering.

- Design for Testability: Incorporate built-in self-test (BIST) circuits and test access mechanisms (TAMs) to facilitate testing and debugging of the FPGA design during development and production.

EP3SE50F484C4N FAQ

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3. Are the EP3SE50F484C4N price and inventory displayed accurate?

The price and inventory of EP3SE50F484C4N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of EP3SE50F484C4N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP3SE50F484C4N we delivered, we will accept the replacement or return of the EP3SE50F484C4N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP3SE50F484C4N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations