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Name: EP3SE260F1152I4LN
Brand: Intel
SKU: EP3SE260F1152I4LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP3SE260F1152I4LN

Part No.:: EP3SE260F1152I4LN

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: EP3SE260F1152I4LN.pdf

Description:: IC FPGA 744 I/O 1152FBGA

In Stock:: 2287

Quantity:: Add To Cart

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EP3SE260F1152I4LN Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® III E
ProductStatus:
Obsolete
NumberofLABs/CLBs:
10200
NumberofLogicElements/Cells:
255000
TotalRAMBits:
16672768
NumberofI/O:
744
NumberofGates:
-
Voltage-Supply:
0.86V ~ 1.15V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

EP3SE260F1152I4LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP3SE260F1152I4LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP3SE260F1152I4LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP3SE260F1152I4LN information

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The application and technological advancement of EP3SE260F1152I4LN in specific industries

EP3SE260F1152I4LN is a field-programmable gate array (FPGA) chip known for its high-performance capabilities and versatility, making it suitable for a wide range of applications across different industries.

Application Scenario:

In the aerospace industry, EP3SE260F1152I4LN plays a crucial role in enhancing the functionality and reliability of onboard systems in spacecraft and satellites.

Circuit Design:

To integrate EP3SE260F1152I4LN into aerospace applications, the following steps can be followed:

1. Sensor Interface:

Connect sensors for various parameters such as temperature, pressure, and position to EP3SE260F1152I4LN. Utilize its high-speed I/O capabilities to interface with these sensors and acquire real-time data.

2. Signal Processing:

Utilize the programmable logic resources of EP3SE260F1152I4LN to implement signal processing algorithms for data filtering, compression, and encryption, ensuring efficient data transmission and storage onboard spacecraft.

3. Communication:

Integrate communication interfaces such as UART, SPI, or Ethernet to establish reliable communication links with ground stations or other spacecraft. Utilize the flexibility of EP3SE260F1152I4LN to adapt to different communication protocols and standards.

4. Fault Tolerance:

Implement redundancy and error-checking mechanisms within the FPGA design to enhance system reliability and fault tolerance, critical for mission-critical applications in space where repair or maintenance is not feasible.

5. Power Management:

Design efficient power management circuits to ensure optimal power distribution and consumption within the spacecraft. Utilize EP3SE260F1152I4LN's low-power modes and dynamic power management features to minimize energy consumption during different operational phases.

Considerations:

When designing FPGA-based systems for aerospace applications, it's essential to consider:

- Radiation Hardening: Implement radiation-hardening techniques to protect EP3SE260F1152I4LN from the harsh space environment and mitigate the effects of radiation-induced single-event upsets (SEUs).

- Thermal Management: Ensure proper thermal management to dissipate heat generated by EP3SE260F1152I4LN and other onboard electronics, preventing overheating and ensuring reliable operation in space.

- Compliance and Certification: Adhere to industry standards and certification requirements for aerospace electronics, including DO-254 for FPGA design assurance and MIL-STD-1540 for environmental testing and qualification.

- System Integration and Testing: Conduct rigorous integration and testing procedures to verify the functionality, performance, and reliability of the FPGA-based systems in simulated space environments before deployment.

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6. What is the process for return or replacement of EP3SE260F1152I4LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP3SE260F1152I4LN we delivered, we will accept the replacement or return of the EP3SE260F1152I4LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP3SE260F1152I4LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations