What is the Additional Feature ?

Name: EP2AGZ350HF40I3N
Brand: Intel
SKU: EP2AGZ350HF40I3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP2AGZ350HF40I3N

Part No.:: EP2AGZ350HF40I3N

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: EP2AGZ350HF40I3N.pdf

Description:: IC FPGA 734 I/O 1517FBGA

In Stock:: 2753

Quantity:: Add To Cart

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EP2AGZ350HF40I3N Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria II GZ
ProductStatus:
Obsolete
NumberofLABs/CLBs:
13940
NumberofLogicElements/Cells:
348500
TotalRAMBits:
21270528
NumberofI/O:
734
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

EP2AGZ350HF40I3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP2AGZ350HF40I3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP2AGZ350HF40I3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP2AGZ350HF40I3N information

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EP2AGZ350HF40I3N Application Introduction

EP2AGZ350HF40I3N is a high-density FPGA (Field-Programmable Gate Array) device manufactured by Intel, offering advanced features and performance for a wide range of applications.

Application Scenario:

In telecommunications infrastructure, EP2AGZ350HF40I3N can be utilized for implementing high-speed data processing and protocol handling tasks, such as packet switching and routing in network equipment.

Circuit Design:

To effectively utilize EP2AGZ350HF40I3N in a design project, consider the following aspects:

1. Power Management:

Implement efficient power management techniques to ensure stable and clean power supply to EP2AGZ350HF40I3N and associated components. Use dedicated power planes, decoupling capacitors, and voltage regulators to minimize noise and ensure reliable operation.

2. Signal Integrity:

Optimize the PCB layout to minimize signal distortions and reflections, especially for high-speed interfaces and critical signal paths. Use controlled impedance traces, proper termination techniques, and signal integrity analysis tools to maintain signal integrity.

3. Thermal Management:

Design an effective thermal management solution to dissipate heat generated by EP2AGZ350HF40I3N during operation. Utilize heat sinks, thermal vias, and airflow optimization to prevent overheating and ensure reliable long-term performance.

4. Clock Distribution:

Implement a robust clock distribution network to ensure precise and stable clock signals throughout the FPGA design. Use low-skew routing techniques, clock buffers, and clock tree synthesis tools to minimize clock skew and jitter.

5. Design Optimization:

Optimize the FPGA design to maximize resource utilization and performance while minimizing power consumption. Utilize advanced synthesis and optimization tools provided by the FPGA vendor to achieve optimal results.

Considerations:

When designing with EP2AGZ350HF40I3N, it's essential to consider:

- I/O Planning: Properly plan and assign I/O pins to interface with external components and peripherals, considering signal timing and voltage levels.

- Design Constraints: Adhere to timing, area, and power constraints specified by the FPGA datasheet and design guidelines to ensure design correctness and reliability.

- Design Validation: Thoroughly validate the FPGA design through simulation, emulation, and prototyping to ensure functionality, performance, and compliance with project requirements.

- Design Security: Implement appropriate security measures, such as bitstream encryption and authentication, to protect the FPGA design from unauthorized access and tampering.

- Future Scalability: Design the FPGA system with scalability in mind to accommodate future enhancements and upgrades, such as additional features or increased processing capabilities.

EP2AGZ350HF40I3N FAQ

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3. Are the EP2AGZ350HF40I3N price and inventory displayed accurate?

The price and inventory of EP2AGZ350HF40I3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of EP2AGZ350HF40I3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP2AGZ350HF40I3N we delivered, we will accept the replacement or return of the EP2AGZ350HF40I3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP2AGZ350HF40I3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations