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Name: EP2AGZ350FF35C4N
Brand: Intel
SKU: EP2AGZ350FF35C4N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP2AGZ350FF35C4N

Part No.:: EP2AGZ350FF35C4N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: EP2AGZ350FF35C4N.pdf

Description:: IC FPGA 554 I/O 1152FBGA

In Stock:: 3457

Quantity:: Add To Cart

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EP2AGZ350FF35C4N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria II GZ
ProductStatus:
Obsolete
NumberofLABs/CLBs:
13940
NumberofLogicElements/Cells:
348500
TotalRAMBits:
21270528
NumberofI/O:
554
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

EP2AGZ350FF35C4N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP2AGZ350FF35C4N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP2AGZ350FF35C4N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP2AGZ350FF35C4N information

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EP2AGZ350FF35C4N Application Introduction

EP2AGZ350FF35C4N is a high-density FPGA (Field-Programmable Gate Array) device offering versatile programmable logic capabilities, commonly utilized in various digital design projects for its flexibility and performance.

Application Scope:

In digital signal processing applications, EP2AGZ350FF35C4N can be employed to implement complex algorithms for tasks such as image processing, audio filtering, and communications signal modulation.

Design Considerations:

When incorporating EP2AGZ350FF35C4N into your design project, consider the following aspects for optimal performance:

1. Power Management:

Implement efficient power management techniques to ensure stable and clean power supply to the EP2AGZ350FF35C4N device and associated components. Utilize low-dropout regulators and filtering capacitors to minimize noise and voltage fluctuations.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal distortion and ensure reliable data transmission between the EP2AGZ350FF35C4N FPGA and external devices. Use controlled impedance traces, proper termination techniques, and ground planes to mitigate signal integrity issues.

3. Thermal Management:

Ensure effective heat dissipation for the EP2AGZ350FF35C4N device to prevent overheating and maintain stable operation. Incorporate thermal vias, heatsinks, or fans in the PCB layout to dissipate heat efficiently.

4. Clock Distribution:

Implement a robust clock distribution network to provide stable and synchronized clock signals to the EP2AGZ350FF35C4N FPGA and other clock-dependent components. Use low-skew routing techniques and clock buffer devices to minimize clock skew and jitter.

5. Configuration and Debugging:

Develop a reliable configuration and debugging interface for the EP2AGZ350FF35C4N FPGA to facilitate programming and testing during the development phase. Utilize JTAG or USB interfaces for configuration and debugging purposes.

Optimization Strategies:

To optimize the design using EP2AGZ350FF35C4N, consider the following strategies:

- Resource Utilization: Efficiently utilize the programmable logic resources available in the EP2AGZ350FF35C4N device to minimize resource wastage and maximize design flexibility.

- Timing Closure: Perform thorough timing analysis and optimization to ensure that the design meets the required timing constraints and operates reliably at the target clock frequency.

- Parallelism: Exploit parallel processing capabilities of the EP2AGZ350FF35C4N FPGA to accelerate computation-intensive tasks and improve overall system performance.

- Design Reuse: Encapsulate frequently used design blocks into reusable IP (Intellectual Property) cores to streamline the development process and improve design modularity.

- Verification and Testing: Implement comprehensive verification and testing methodologies to validate the functionality and performance of the design under various operating conditions and corner cases.

Conclusion:

Incorporating EP2AGZ350FF35C4N into your design project requires careful consideration of power management, signal integrity, thermal management, clock distribution, and configuration/debugging aspects. By following the optimization strategies outlined above, you can ensure efficient utilization of the FPGA resources and achieve optimal performance in your design.

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6. What is the process for return or replacement of EP2AGZ350FF35C4N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP2AGZ350FF35C4N we delivered, we will accept the replacement or return of the EP2AGZ350FF35C4N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP2AGZ350FF35C4N.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations