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Name: EP2AGZ300HF40I3N
Brand: Intel
SKU: EP2AGZ300HF40I3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP2AGZ300HF40I3N

Part No.:: EP2AGZ300HF40I3N

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: EP2AGZ300HF40I3N.pdf

Description:: IC FPGA 734 I/O 1517FBGA

In Stock:: 3421

Quantity:: Add To Cart

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EP2AGZ300HF40I3N Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria II GZ
ProductStatus:
Obsolete
NumberofLABs/CLBs:
11920
NumberofLogicElements/Cells:
298000
TotalRAMBits:
18854912
NumberofI/O:
734
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

EP2AGZ300HF40I3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP2AGZ300HF40I3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP2AGZ300HF40I3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP2AGZ300HF40I3N information

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EP2AGZ300HF40I3N Application Introduction

EP2AGZ300HF40I3N is a high-performance FPGA (Field Programmable Gate Array) device designed by Intel for various applications, including industrial automation, telecommunications, and automotive systems.

Application Scenario:

In industrial automation, EP2AGZ300HF40I3N can be utilized for tasks such as real-time control of manufacturing processes, data acquisition, and processing in PLC (Programmable Logic Controller) systems.

Design Optimization:

To effectively use EP2AGZ300HF40I3N in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization and minimize power consumption. Utilize power gating, dynamic voltage scaling, and power-saving modes available in EP2AGZ300HF40I3N to achieve energy efficiency.

2. Signal Integrity:

Pay attention to signal integrity considerations to maintain reliable communication within the FPGA and with external devices. Proper PCB layout techniques, such as impedance matching, signal routing, and minimizing signal reflections, are crucial for preserving signal integrity.

3. Thermal Management:

Manage thermal performance effectively to prevent overheating and ensure reliable operation of EP2AGZ300HF40I3N. Employ thermal vias, heatsinks, and proper airflow within the system enclosure to dissipate heat efficiently and maintain optimal operating temperatures.

4. Clocking Strategy:

Design a robust clocking strategy to ensure synchronous operation and timing closure in the FPGA design. Utilize PLLs (Phase-Locked Loops) and clock distribution networks efficiently to generate and distribute clock signals with low jitter and skew.

5. Design for Testability:

Incorporate features for testability to facilitate debugging, verification, and testing of the FPGA design. Utilize built-in self-test (BIST) structures, boundary scan, and JTAG (Joint Test Action Group) interfaces for efficient testing and diagnosis of potential faults.

Considerations:

When optimizing the design with EP2AGZ300HF40I3N, keep in mind the following considerations:

- Resource Utilization: Optimize the utilization of FPGA resources, including logic elements, memory blocks, and DSP (Digital Signal Processing) slices, to maximize design efficiency and performance.

- Timing Closure: Pay attention to timing constraints and perform timing analysis to ensure that the design meets timing requirements and achieves reliable operation at the specified clock frequencies.

- Design Modularity: Organize the design into modular blocks and utilize hierarchical design methodologies to enhance readability, maintainability, and scalability of the FPGA design.

- Security Considerations: Implement security features, such as encryption, authentication, and access control, to protect the FPGA design and intellectual property from unauthorized access, tampering, or reverse engineering.

- Compliance and Standards: Ensure compliance with industry standards and regulations relevant to the application domain, such as safety standards in automotive or industrial environments, to meet certification requirements and ensure product reliability and safety.

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3. Are the EP2AGZ300HF40I3N price and inventory displayed accurate?

The price and inventory of EP2AGZ300HF40I3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of EP2AGZ300HF40I3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP2AGZ300HF40I3N we delivered, we will accept the replacement or return of the EP2AGZ300HF40I3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP2AGZ300HF40I3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations