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Name: EP2AGZ300FF35C4N
Brand: Intel
SKU: EP2AGZ300FF35C4N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP2AGZ300FF35C4N

Part No.:: EP2AGZ300FF35C4N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: EP2AGZ300FF35C4N.pdf

Description:: IC FPGA 554 I/O 1152FBGA

In Stock:: 2354

Quantity:: Add To Cart

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EP2AGZ300FF35C4N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria II GZ
ProductStatus:
Obsolete
NumberofLABs/CLBs:
11920
NumberofLogicElements/Cells:
298000
TotalRAMBits:
18854912
NumberofI/O:
554
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

EP2AGZ300FF35C4N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP2AGZ300FF35C4N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP2AGZ300FF35C4N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP2AGZ300FF35C4N information

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EP2AGZ300FF35C4N Application Introduction

EP2AGZ300FF35C4N is a high-density FPGA device designed by Intel for demanding applications, offering a balance of performance, power efficiency, and versatility.

Application Scenario:

In telecommunications infrastructure, EP2AGZ300FF35C4N can be utilized for implementing signal processing algorithms, such as digital filtering and modulation/demodulation, in high-speed communication systems.

Circuit Design:

To effectively use EP2AGZ300FF35C4N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption while maintaining stable operation. Utilize advanced power-saving modes offered by EP2AGZ300FF35C4N and incorporate power gating and clock gating strategies to dynamically control power usage.

2. Signal Integrity:

Ensure signal integrity by carefully designing high-speed signal traces, minimizing signal reflections, and employing termination techniques like series resistors or termination resistors. Utilize differential signaling for critical high-speed interfaces to improve noise immunity and reduce signal degradation.

3. Thermal Management:

Optimize thermal management by carefully planning the placement of heat-generating components on the PCB and incorporating heat sinks or thermal vias to dissipate heat efficiently. Monitor temperature levels using on-chip temperature sensors and implement thermal throttling mechanisms to prevent overheating.

4. Clock Distribution:

Design a robust clock distribution network to ensure precise timing and synchronization throughout the FPGA design. Utilize clock conditioning circuits, such as PLLs and DLLs, to generate stable clock signals and minimize clock skew.

5. I/O Planning:

Optimize I/O planning by carefully assigning I/O standards and voltage levels to interface with external devices. Utilize on-chip I/O resources efficiently and consider the use of LVDS or SERDES interfaces for high-speed data transmission.

Considerations:

When designing with EP2AGZ300FF35C4N, it's important to consider:

- Design Constraints: Take into account timing constraints, resource utilization, and routing limitations to ensure successful implementation of the design within the FPGA's capabilities.

- Design Security: Implement security features, such as encryption and authentication mechanisms, to protect the intellectual property and sensitive data stored within the FPGA design.

- Design Verification: Conduct thorough functional testing and simulation to verify the correctness and reliability of the FPGA design under various operating conditions and corner cases.

- Design Scalability: Design the FPGA firmware with scalability in mind to accommodate future upgrades or enhancements without requiring significant redesign or reconfiguration.

- Design Documentation: Maintain comprehensive documentation of the FPGA design, including design specifications, schematics, and design constraints, to facilitate collaboration and future troubleshooting.

EP2AGZ300FF35C4N FAQ

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3. Are the EP2AGZ300FF35C4N price and inventory displayed accurate?

The price and inventory of EP2AGZ300FF35C4N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of EP2AGZ300FF35C4N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP2AGZ300FF35C4N we delivered, we will accept the replacement or return of the EP2AGZ300FF35C4N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP2AGZ300FF35C4N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations