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Name: EP2AGZ225HF40I3N
Brand: Intel
SKU: EP2AGZ225HF40I3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP2AGZ225HF40I3N

Part No.:: EP2AGZ225HF40I3N

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: EP2AGZ225HF40I3N.pdf

Description:: IC FPGA 734 I/O 1517FBGA

In Stock:: 3205

Quantity:: Add To Cart

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EP2AGZ225HF40I3N Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria II GZ
ProductStatus:
Obsolete
NumberofLABs/CLBs:
8960
NumberofLogicElements/Cells:
224000
TotalRAMBits:
14248960
NumberofI/O:
734
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

EP2AGZ225HF40I3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP2AGZ225HF40I3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP2AGZ225HF40I3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP2AGZ225HF40I3N information

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EP2AGZ225HF40I3N Application Introduction

EP2AGZ225HF40I3N is a field-programmable gate array (FPGA) chip renowned for its high performance and versatility, commonly used in a variety of electronic design projects.

Application Scenario:

In digital signal processing applications, EP2AGZ225HF40I3N can be utilized for real-time data processing tasks, such as image processing in medical imaging devices.

Circuit Design:

To effectively utilize EP2AGZ225HF40I3N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization and minimize power consumption of EP2AGZ225HF40I3N and associated peripherals. Utilize low-power modes and dynamic voltage scaling to optimize power usage during different operational states.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues such as noise, crosstalk, and signal distortion. Utilize proper grounding techniques, controlled impedance traces, and signal isolation to maintain signal integrity and ensure reliable communication within the system.

3. Thermal Management:

Implement effective thermal management strategies to dissipate heat generated by EP2AGZ225HF40I3N and prevent overheating. Utilize heat sinks, thermal vias, and proper airflow design to maintain optimal operating temperatures and ensure long-term reliability of the FPGA chip.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and accurate clock signals to EP2AGZ225HF40I3N and other synchronous components in the system. Use low-jitter clock sources, proper termination techniques, and clock tree synthesis to minimize clock skew and ensure synchronous operation of the FPGA.

5. Configuration Management:

Optimize the FPGA configuration process to streamline design iterations and facilitate rapid prototyping. Utilize configuration storage devices, such as flash memory or EEPROM, and implement efficient configuration interfaces, such as JTAG or SPI, to enable seamless reconfiguration of EP2AGZ225HF40I3N during development and deployment phases.

Considerations:

When designing with EP2AGZ225HF40I3N, it's important to consider:

- Resource Utilization: Efficiently utilize the available logic resources, memory blocks, and DSP slices of the FPGA to maximize performance and minimize resource wastage.

- Timing Closure: Perform thorough timing analysis and optimization to ensure that all timing constraints are met and critical paths are optimized for maximum operating frequency.

- Design Validation: Conduct comprehensive functional and timing simulations, as well as hardware-in-the-loop testing, to verify the correctness and performance of the FPGA design under various operating conditions.

- Design Reusability: Modularize the FPGA design and utilize reusable IP cores and design blocks to facilitate design reuse and accelerate future projects.

- Documentation: Maintain detailed documentation of the FPGA design, including design specifications, block diagrams, timing constraints, and verification results, to aid in design understanding, debugging, and future maintenance.

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6. What is the process for return or replacement of EP2AGZ225HF40I3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP2AGZ225HF40I3N we delivered, we will accept the replacement or return of the EP2AGZ225HF40I3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP2AGZ225HF40I3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations