What is the Additional Feature ?

Name: EP2AGX65DF25I3
Brand: Intel
SKU: EP2AGX65DF25I3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP2AGX65DF25I3

Part No.:: EP2AGX65DF25I3

Manufacturer:: Intel

Package:: 572-BGA, FCBGA

Datasheet:: EP2AGX65DF25I3.pdf

Description:: IC FPGA 252 I/O 572FBGA

In Stock:: 3212

Quantity:: Add To Cart

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EP2AGX65DF25I3 Specifications

Package/Case:
572-BGA, FCBGA
Packaging:
Tray
Series:
Arria II GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
2530
NumberofLogicElements/Cells:
60214
TotalRAMBits:
5371904
NumberofI/O:
252
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

EP2AGX65DF25I3 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP2AGX65DF25I3 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP2AGX65DF25I3 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP2AGX65DF25I3 information

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The application and technological advancement of EP2AGX65DF25I3 in specific industries

EP2AGX65DF25I3 is a high-performance FPGA (Field-Programmable Gate Array) chip designed for demanding applications in various industries. It offers exceptional flexibility, processing power, and integration capabilities, making it ideal for a wide range of applications.

Application Scenario:

In the aerospace industry, EP2AGX65DF25I3 plays a crucial role in mission-critical systems such as satellite communication, radar signal processing, and onboard computing. Its reconfigurable nature allows for adaptability to evolving mission requirements and ensures optimal performance in challenging environments.

Circuit Design:

To harness the capabilities of EP2AGX65DF25I3 in aerospace applications, the circuit design must adhere to stringent requirements for reliability, radiation tolerance, and power efficiency. Here's a breakdown of key considerations:

1. Radiation Hardening:

Implement radiation-hardening techniques such as triple modular redundancy (TMR) and error-correcting codes (ECC) to mitigate the effects of radiation-induced single-event upsets (SEUs) and ensure the integrity of data processing in space environments.

2. Communication Interfaces:

Integrate communication interfaces compatible with space-grade standards, such as SpaceWire or MIL-STD-1553, to facilitate reliable data exchange between the FPGA and other spacecraft subsystems. Implement robust error detection and correction mechanisms to ensure data integrity over long-distance transmissions.

3. Signal Processing:

Utilize the parallel processing capabilities of EP2AGX65DF25I3 to perform complex signal processing tasks such as radar beamforming, image enhancement, and spectral analysis. Implement optimized algorithms to maximize processing throughput and minimize latency for real-time applications.

4. Power Management:

Design efficient power management circuitry to minimize power consumption and maximize battery life in space-based systems. Utilize low-power design techniques such as clock gating, power gating, and dynamic voltage and frequency scaling (DVFS) to optimize power utilization without compromising performance.

5. Fault Tolerance:

Implement built-in self-test (BIST) capabilities and redundant resources within the FPGA fabric to detect and recover from faults caused by radiation or hardware degradation. Employ advanced fault-tolerant architectures such as partial reconfiguration and hot swapping to ensure continuous operation despite component failures.

Impact on Industry:

The integration of EP2AGX65DF25I3 in aerospace applications revolutionizes the industry by providing a versatile platform for the development of advanced satellite systems, space exploration missions, and defense applications. Its reconfigurable architecture and robust performance elevate industry standards for reliability, flexibility, and mission success.

Conclusion:

EP2AGX65DF25I3 serves as a cornerstone technology in the aerospace industry, empowering engineers and researchers to push the boundaries of space exploration and satellite communication. Its unparalleled capabilities in signal processing, communication, and fault tolerance redefine industry benchmarks and pave the way for future advancements in space technology.

EP2AGX65DF25I3 FAQ

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3. Are the EP2AGX65DF25I3 price and inventory displayed accurate?

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6. What is the process for return or replacement of EP2AGX65DF25I3?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP2AGX65DF25I3 we delivered, we will accept the replacement or return of the EP2AGX65DF25I3 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP2AGX65DF25I3.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations