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Name: EP2AGX260FF35I5G
Brand: Intel
SKU: EP2AGX260FF35I5G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP2AGX260FF35I5G

Part No.:: EP2AGX260FF35I5G

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: EP2AGX260FF35I5G.pdf

Description:: IC FPGA 612 I/O 1152FBGA

In Stock:: 3853

Quantity:: Add To Cart

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EP2AGX260FF35I5G Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria II GX
ProductStatus:
Active
NumberofLABs/CLBs:
10260
NumberofLogicElements/Cells:
244188
TotalRAMBits:
12038144
NumberofI/O:
612
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

EP2AGX260FF35I5G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP2AGX260FF35I5G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP2AGX260FF35I5G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP2AGX260FF35I5G information

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EP2AGX260FF35I5G Application Introduction

EP2AGX260FF35I5G is a high-performance FPGA (Field-Programmable Gate Array) widely used in various electronic design projects for its flexibility and computational power.

Application Scenario:

In digital signal processing applications, EP2AGX260FF35I5G can be utilized for real-time data processing and analysis, such as in radar systems or image processing.

Circuit Design:

To effectively use EP2AGX260FF35I5G in your design project, consider the following optimization techniques:

1. Power Management:

Implement robust power management circuitry to ensure stable voltage and current supply to EP2AGX260FF35I5G and associated components. Utilize high-quality voltage regulators, decoupling capacitors, and proper grounding techniques to minimize noise and ensure reliable operation.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal interference, crosstalk, and transmission line effects. Follow best practices for high-speed digital design, such as proper impedance matching, controlled impedance traces, and signal routing techniques to maintain signal integrity and reduce jitter.

3. Thermal Management:

Ensure effective thermal management to prevent overheating of EP2AGX260FF35I5G during operation. Use proper heat sinks, thermal vias, and airflow design to dissipate heat efficiently. Monitor temperature levels and implement thermal shutdown mechanisms if necessary to protect the FPGA from damage.

4. Clock Distribution:

Optimize clock distribution to minimize clock skew and ensure reliable synchronization of signals within the FPGA design. Use dedicated clock networks, phase-locked loops (PLLs), and clock tree synthesis techniques to generate and distribute clock signals with low jitter and minimal skew.

5. I/O Interface:

Design robust I/O interfaces to interface EP2AGX260FF35I5G with external devices or peripherals. Utilize appropriate interface standards, such as LVDS (Low Voltage Differential Signaling) or DDR (Double Data Rate), and follow recommended guidelines for signal termination, impedance matching, and noise immunity to ensure reliable communication.

Considerations:

When designing with EP2AGX260FF35I5G, it's crucial to consider:

- Design Constraints: Understand the device specifications, including maximum operating frequency, I/O standards, and resource utilization, to optimize the design for performance and resource efficiency.

- Design Verification: Perform thorough functional testing and simulation to verify the correctness and reliability of the FPGA design, including functional correctness, timing analysis, and reliability testing under various operating conditions.

- Design Iteration: Iterate on the design based on simulation results, feedback from prototype testing, and performance optimization to achieve the desired functionality and performance targets.

- Documentation: Maintain comprehensive documentation throughout the design process, including schematics, PCB layouts, design constraints, and simulation results, to facilitate future design iterations, debugging, and troubleshooting.

- Compliance and Standards: Ensure compliance with relevant industry standards, such as FPGA design guidelines, EMC/EMI regulations, and safety standards, to ensure interoperability, reliability, and regulatory compliance of the final product.

EP2AGX260FF35I5G FAQ

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3. Are the EP2AGX260FF35I5G price and inventory displayed accurate?

The price and inventory of EP2AGX260FF35I5G fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of EP2AGX260FF35I5G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP2AGX260FF35I5G we delivered, we will accept the replacement or return of the EP2AGX260FF35I5G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP2AGX260FF35I5G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations